Part Details for CZ12010T0050GBK by Kyocera AVX Components
Results Overview of CZ12010T0050GBK by Kyocera AVX Components
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Automotive
CZ12010T0050GBK Information
CZ12010T0050GBK by Kyocera AVX Components is an RF/Microwave Termination.
RF/Microwave Terminations are under the broader part category of RF and Microwave Components.
RF and Microwave Engineering focuses on the design and operation of devices that transmit or receive radio waves. The main distinction between RF and microwave engineering is their wavelength, which influences how energy is transmitted and used in various applications. Read more about RF and Microwave Components on our RF and Microwave part category page.
Price & Stock for CZ12010T0050GBK
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CZ12010T0050GBK
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Avnet Americas | HIGH POWER RF RESISTIVE - Waffle Pack (Alt: CZ12010T0050GBK) RoHS: Compliant Min Qty: 180 Package Multiple: 180 Lead time: 8 Weeks, 0 Days Container: Waffle Pack | 0 |
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$2.9869 / $3.1877 | Buy Now |
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DISTI #
CZ12010T0050GBK
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Richardson RFPD | RF TERMINATION RoHS: Compliant Min Qty: 1 | 3 |
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RFQ |
Part Details for CZ12010T0050GBK
CZ12010T0050GBK CAD Models
CZ12010T0050GBK Part Data Attributes
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CZ12010T0050GBK
Kyocera AVX Components
Buy Now
Datasheet
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Compare Parts:
CZ12010T0050GBK
Kyocera AVX Components
RF/Microwave Termination, 0MHz Min, 3000MHz Max, 50ohm,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | KYOCERA AVX COMPONENTS CORP | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 8 Weeks | |
| Characteristic Impedance | 50 Ω | |
| Construction | COMPONENT | |
| Input Power-Max (CW) | 40 dBm | |
| JESD-609 Code | e4 | |
| Mounting Feature | SURFACE MOUNT | |
| Number of Terminals | 2 | |
| Operating Frequency-Max | 3000 MHz | |
| Operating Frequency-Min | ||
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Equivalence Code | DIE OR CHIP | |
| RF/Microwave Device Type | RF/MICROWAVE TERMINATION | |
| Screening Level | MIL-PRF-55342 | |
| Surface Mount | YES | |
| Terminal Finish | Silver (Ag) - with Nickel (Ni) barrier | |
| VSWR-Max | 1.2 |
CZ12010T0050GBK Frequently Asked Questions (FAQ)
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The recommended land pattern for CZ12010T0050GBK is a rectangular pad with a size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper solder joint formation and minimizes the risk of solder bridging.
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While CZ12010T0050GBK is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the component's reliability may be affected by prolonged exposure to high temperatures, so it's recommended to consult with Kyocera AVX Components or a qualified engineer for specific guidance.
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CZ12010T0050GBK is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. It's essential to follow the recommended storage and handling procedures outlined in the datasheet, including storing the components in a dry, nitrogen-filled environment and avoiding exposure to high humidity or temperature fluctuations.
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The recommended soldering profile for CZ12010T0050GBK is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow a controlled soldering process to prevent thermal shock and ensure reliable solder joints.
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While CZ12010T0050GBK is designed to be robust, it's essential to consider the component's mechanical stress limits and ensure that it is properly secured to the PCB to prevent damage or detachment. Consult with Kyocera AVX Components or a qualified engineer for specific guidance on using the component in high-vibration or high-shock applications.