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CYW15G0403DXB-BGI by:

SPECIALTY TELECOM CIRCUIT, PBGA256, 27 X 27 MM, 1.57 MM HEIGHT, BGA-256

Part Details for CYW15G0403DXB-BGI by Rochester Electronics LLC

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CYW15G0403DXB-BGI Information

CYW15G0403DXB-BGI by Rochester Electronics LLC is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Part Details for CYW15G0403DXB-BGI

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CYW15G0403DXB-BGI Part Data Attributes

CYW15G0403DXB-BGI Rochester Electronics LLC
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CYW15G0403DXB-BGI Rochester Electronics LLC SPECIALTY TELECOM CIRCUIT, PBGA256, 27 X 27 MM, 1.57 MM HEIGHT, BGA-256
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer ROCHESTER ELECTRONICS LLC
Part Package Code BGA
Package Description 27 X 27 MM, 1.57 MM HEIGHT, BGA-256
Pin Count 256
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
Length 27 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code HBGA
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 235
Qualification Status COMMERCIAL
Seated Height-Max 1.745 mm
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology BICMOS
Telecom IC Type TELECOM CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 27 mm

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