Part Details for CYW15G0403DXB-BGI by Rochester Electronics LLC
Results Overview of CYW15G0403DXB-BGI by Rochester Electronics LLC
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CYW15G0403DXB-BGI Information
CYW15G0403DXB-BGI by Rochester Electronics LLC is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Part Details for CYW15G0403DXB-BGI
CYW15G0403DXB-BGI CAD Models
CYW15G0403DXB-BGI Part Data Attributes
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CYW15G0403DXB-BGI
Rochester Electronics LLC
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Datasheet
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CYW15G0403DXB-BGI
Rochester Electronics LLC
SPECIALTY TELECOM CIRCUIT, PBGA256, 27 X 27 MM, 1.57 MM HEIGHT, BGA-256
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
Part Package Code | BGA | |
Package Description | 27 X 27 MM, 1.57 MM HEIGHT, BGA-256 | |
Pin Count | 256 | |
Reach Compliance Code | unknown | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
Length | 27 mm | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 235 | |
Qualification Status | COMMERCIAL | |
Seated Height-Max | 1.745 mm | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | BICMOS | |
Telecom IC Type | TELECOM CIRCUIT | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 27 mm |