Part Details for CYBLE-022001-00 by Infineon Technologies AG
Results Overview of CYBLE-022001-00 by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CYBLE-022001-00 Information
CYBLE-022001-00 by Infineon Technologies AG is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for CYBLE-022001-00
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
2646429
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Farnell | BLE MODULE, V.4.1, 2.4GHZ, SINGLE MODE RoHS: Compliant Min Qty: 1 Lead time: 14 Weeks, 1 Days Container: Each | 48 |
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$12.2620 / $19.1968 | Buy Now |
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DISTI #
CYBLE-022001-00
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Avnet Americas | Bluetooth Module, V 5.1 LE, Class 2, 2.4GHz to 2.482GHz, 0 dBm, -87dBm - Tape and Reel (Alt: CYBLE-022001-00) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 111 Weeks, 0 Days Container: Reel | 0 |
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RFQ | |
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DISTI #
SP005672791
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EBV Elektronik | Bluetooth Module V 51 LE Class 2 24GHz to 2482GHz 0 dBm 87dBm (Alt: SP005672791) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Vyrian | Peripheral ICs | 328 |
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RFQ | |
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Win Source Electronics | RF TXRX MOD BLUETOOTH CHIP SMD / Bluetooth Bluetooth v4.1 Transceiver Module 2.4GHz Integrated, Chip Surface Mount | 5000 |
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$8.5663 / $11.0647 | Buy Now |
Part Details for CYBLE-022001-00
CYBLE-022001-00 CAD Models
CYBLE-022001-00 Part Data Attributes
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CYBLE-022001-00
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
CYBLE-022001-00
Infineon Technologies AG
PSoC,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | Infineon | |
| JESD-30 Code | S-XXMA-N21 | |
| Length | 10 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 21 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | XMA | |
| Package Shape | SQUARE | |
| Package Style | MICROELECTRONIC ASSEMBLY | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 1.8 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.762 mm | |
| Terminal Position | UNSPECIFIED | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC |
CYBLE-022001-00 Frequently Asked Questions (FAQ)
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For optimal performance, it is recommended to follow Infineon's guidelines for PCB layout and design, including using a solid ground plane, minimizing trace lengths, and using a 50-ohm transmission line for the antenna. Additionally, ensure proper decoupling and filtering of power supplies.
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Implement secure boot by using Infineon's Secure Bootloader and following their guidelines for secure firmware updates. This includes using cryptographic algorithms, secure key storage, and authenticated firmware updates.
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Ensure proper thermal management by providing adequate heat dissipation, using thermal pads or heat sinks, and following Infineon's guidelines for thermal design. In high-temperature environments, consider using thermal interface materials and heat sinks to maintain optimal operating temperatures.
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Optimize power consumption by using low-power modes, reducing clock frequencies, and minimizing active time. Implement power gating, use low-power peripherals, and consider using Infineon's power management ICs to reduce current drain.
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Ensure EMI and EMC compliance by following Infineon's guidelines for PCB layout, using shielding, and implementing EMI filters. Conduct thorough testing and simulation to ensure compliance with regulatory standards such as FCC, CE, and CISPR.