Part Details for CY7C1315KV18-250BZXC by Cypress Semiconductor
Results Overview of CY7C1315KV18-250BZXC by Cypress Semiconductor
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (6 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CY7C1315KV18-250BZXC Information
CY7C1315KV18-250BZXC by Cypress Semiconductor is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for CY7C1315KV18-250BZXC
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY7C1315KV18-250BZXC-ND
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DigiKey | QDR SRAM, 512KX36, 0.45NS PBGA16 Min Qty: 11 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
112 In Stock |
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$29.0800 | Buy Now |
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DISTI #
85975341
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Verical | SRAM Chip Sync Dual 1.8V 18M-bit 512K x 36 0.45ns 165-Pin FBGA Tray RoHS: Compliant Min Qty: 25 Package Multiple: 1 Date Code: 1201 | Americas - 65 |
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$27.9625 / $34.9500 | Buy Now |
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DISTI #
85973885
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Verical | SRAM Chip Sync Dual 1.8V 18M-bit 512K x 36 0.45ns 165-Pin FBGA Tray RoHS: Compliant Min Qty: 25 Package Multiple: 1 Date Code: 1301 | Americas - 47 |
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$27.9625 / $34.9500 | Buy Now |
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Rochester Electronics | QDR SRAM, 512KX36, 0.45ns PBGA165 RoHS: Compliant pbFree: No Status: End of Life / Last Time Buy Min Qty: 1 | 112 |
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$22.3700 / $27.9600 | Buy Now |
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Flip Electronics | Stock | 9396 |
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RFQ |
Part Details for CY7C1315KV18-250BZXC
CY7C1315KV18-250BZXC CAD Models
CY7C1315KV18-250BZXC Part Data Attributes
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CY7C1315KV18-250BZXC
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY7C1315KV18-250BZXC
Cypress Semiconductor
QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
| Part Package Code | BGA | |
| Package Description | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | |
| Pin Count | 165 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 0.45 ns | |
| Clock Frequency-Max (fCLK) | 250 MHz | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-PBGA-B165 | |
| JESD-609 Code | e1 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | QDR SRAM | |
| Memory Width | 36 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX36 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA165,11X15,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.4 mm | |
| Standby Current-Max | 0.25 A | |
| Standby Voltage-Min | 1.7 V | |
| Supply Current-Max | 0.59 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 13 mm |
Alternate Parts for CY7C1315KV18-250BZXC
This table gives cross-reference parts and alternative options found for CY7C1315KV18-250BZXC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY7C1315KV18-250BZXC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| CY7C1315KV18-250BZCT | Cypress Semiconductor | Check for Price | Standard SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | CY7C1315KV18-250BZXC vs CY7C1315KV18-250BZCT |
| CY7C1315KV18-250BZXC | Infineon Technologies AG | Check for Price | QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | CY7C1315KV18-250BZXC vs CY7C1315KV18-250BZXC |
CY7C1315KV18-250BZXC Frequently Asked Questions (FAQ)
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The CY7C1315KV18-250BZXC has an operating temperature range of 0°C to 70°C (commercial grade) and -40°C to 100°C (industrial grade).
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To ensure data integrity, Cypress recommends following a controlled power-up and power-down sequence, as outlined in the datasheet. This includes ramping up the power supply voltage slowly (typically 10-20 ms) and ensuring that the clock signal is stable before accessing the device.
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Cypress recommends using a series terminated transmission line (STTL) or a parallel terminated transmission line (PTTL) to ensure signal integrity and minimize reflections.
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To handle CDC, Cypress recommends using synchronizers or FIFOs to transfer data between clock domains. Additionally, ensure that the clock frequencies and phases are properly aligned to prevent metastability issues.
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The maximum current draw for the CY7C1315KV18-250BZXC is 250 mA (typical) and 350 mA (maximum) for the entire device, including all outputs and internal logic.