Part Details for CY27C256A-200WMB by Cypress Semiconductor
Results Overview of CY27C256A-200WMB by Cypress Semiconductor
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CY27C256A-200WMB Information
CY27C256A-200WMB by Cypress Semiconductor is an EPROM.
EPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for CY27C256A-200WMB
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-CY27C256A-200WMB-ND
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DigiKey | IC EPROM 256KBIT PAR 28CERDIP Min Qty: 7 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
64 In Stock |
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$45.0400 | Buy Now |
DISTI #
86106290
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Verical | CY27C256A-200WMB Min Qty: 25 Package Multiple: 1 Date Code: 9901 | Americas - 64 |
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$54.1375 | Buy Now |
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Rochester Electronics | UVPROM, 32KX8, 200ns CDIP28 RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 64 |
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$34.6500 / $43.3100 | Buy Now |
Part Details for CY27C256A-200WMB
CY27C256A-200WMB CAD Models
CY27C256A-200WMB Part Data Attributes
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CY27C256A-200WMB
Cypress Semiconductor
Buy Now
Datasheet
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Compare Parts:
CY27C256A-200WMB
Cypress Semiconductor
UVPROM, 32KX8, 200ns, CMOS, CDIP28, 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | CYPRESS SEMICONDUCTOR CORP | |
Part Package Code | DIP | |
Package Description | 0.600 INCH, HERMETIC SEALED, WINDOWED, CERDIP-28 | |
Pin Count | 28 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.2.C | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
JESD-609 Code | e0 | |
Length | 37.338 mm | |
Memory Density | 262144 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 32768 words | |
Number of Words Code | 32000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Organization | 32KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Programming Voltage | 12.75 V | |
Qualification Status | Not Qualified | |
Screening Level | 38535Q/M;38534H;883B | |
Seated Height-Max | 5.715 mm | |
Standby Current-Max | 0.025 A | |
Supply Current-Max | 0.06 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for CY27C256A-200WMB
This table gives cross-reference parts and alternative options found for CY27C256A-200WMB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CY27C256A-200WMB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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AM27C256-200DIB | AMD | Check for Price | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | CY27C256A-200WMB vs AM27C256-200DIB |
NMC27C256BQ20 | Texas Instruments | Check for Price | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, CERAMIC, DIP-28 | CY27C256A-200WMB vs NMC27C256BQ20 |
AM27C256-200DEB | AMD | Check for Price | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | CY27C256A-200WMB vs AM27C256-200DEB |
AM27C256-205DC | AMD | Check for Price | UVPROM, 32KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | CY27C256A-200WMB vs AM27C256-205DC |
TMS27C256-20JE4 | Texas Instruments | Check for Price | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | CY27C256A-200WMB vs TMS27C256-20JE4 |
M27C256B-20F6L | STMicroelectronics | Check for Price | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | CY27C256A-200WMB vs M27C256B-20F6L |
M27256-2F1 | STMicroelectronics | Check for Price | 32KX8 UVPROM, 200ns, CDIP28, WINDOWED, FRIT SEALED, CERAMIC, DIP-28 | CY27C256A-200WMB vs M27256-2F1 |
AM27256-20DEB | AMD | Check for Price | UVPROM, 32KX8, 200ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | CY27C256A-200WMB vs AM27256-20DEB |
SMJ27C256-20JM | Texas Instruments | Check for Price | 32KX8 UVPROM, 200ns, CDIP28, 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28 | CY27C256A-200WMB vs SMJ27C256-20JM |
TC57256AD-20 | Toshiba America Electronic Components | Check for Price | IC 32K X 8 UVPROM, 200 ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28, Programmable ROM | CY27C256A-200WMB vs TC57256AD-20 |
CY27C256A-200WMB Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the CY27C256A-200WMB is -40°C to +85°C.
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It is recommended to power up the VCC supply before the VPP supply, and power down the VPP supply before the VCC supply to prevent latch-up and ensure proper operation.
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The recommended storage temperature range for the CY27C256A-200WMB is -65°C to +150°C.
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Yes, the CY27C256A-200WMB is compatible with 3.3V systems, but the VPP supply must be at 12.5V ± 0.5V for programming.
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To prevent data corruption, ensure that the VCC supply is stable and within the recommended operating range before accessing the device, and avoid accessing the device during power-up and power-down transitions.