-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
PWM Controller, Integrated, Current Mode, for Forward or Flyback (36 - 75 V Telecom Supply), SOIC-8 Narrow Body, 98-TUBE
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CS5124XD8G by onsemi is a Switching Regulator or Controller.
Switching Regulator or Controllers are under the broader part category of Power Circuits.
A power circuit delivers electricity in order to operate a load for an electronic device. Power circuits include transformers, generators and switches. Read more about Power Circuits on our Power Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
70465952
|
RS | CS5124XD8G, PWM Current Mode Controller, 1.5 A, 440 kHz, 7.7 to 20 V, 8-Pin SOIC Min Qty: 5 Package Multiple: 1 Container: Bulk | 0 |
|
$3.7900 / $4.4500 | RFQ |
DISTI #
CS5124XD8G
|
Avnet Silica | Current Mode PWM Controller 03V to 20V 200mA 8Pin SOIC N Rail (Alt: CS5124XD8G) RoHS: Compliant Min Qty: 98 Package Multiple: 98 Lead time: 143 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
DISTI #
CS5124XD8G
|
EBV Elektronik | Current Mode PWM Controller 03V to 20V 200mA 8Pin SOIC N Rail (Alt: CS5124XD8G) RoHS: Compliant Min Qty: 98 Package Multiple: 98 Lead time: 143 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
CS5124XD8G
onsemi
Buy Now
Datasheet
|
Compare Parts:
CS5124XD8G
onsemi
PWM Controller, Integrated, Current Mode, for Forward or Flyback (36 - 75 V Telecom Supply), SOIC-8 Narrow Body, 98-TUBE
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | SOIC | |
Package Description | SOIC-8 | |
Pin Count | 8 | |
Manufacturer Package Code | 751-07 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Factory Lead Time | 2 Days | |
Samacsys Manufacturer | onsemi | |
Analog IC - Other Type | SWITCHING CONTROLLER | |
Control Mode | CURRENT-MODE | |
Control Technique | PULSE WIDTH MODULATION | |
Input Voltage-Max | 20 V | |
Input Voltage-Min | 7.6 V | |
Input Voltage-Nom | 12 V | |
JESD-30 Code | R-PDSO-G8 | |
JESD-609 Code | e3 | |
Length | 4.9 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Output Current-Max | 1.5 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | SOP | |
Package Equivalence Code | SOP8,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.75 mm | |
Surface Mount | YES | |
Switcher Configuration | SINGLE | |
Switching Frequency-Max | 440 kHz | |
Technology | BICMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 1.27 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3.9 mm |
This table gives cross-reference parts and alternative options found for CS5124XD8G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CS5124XD8G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
CS5124XD8G | Rochester Electronics LLC | Check for Price | 1.5 A SWITCHING CONTROLLER, 440 kHz SWITCHING FREQ-MAX, PDSO8, LEAD FREE, SOIC-8 | CS5124XD8G vs CS5124XD8G |
A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using a thermal interface material to improve heat transfer.
Exceeding the maximum junction temperature can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. Ensure that the device is operated within the recommended temperature range to prevent premature failure.
Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins to protect against electrostatic discharge. Follow proper PCB design and layout guidelines to minimize ESD susceptibility.
Use 0.1uF to 1uF decoupling capacitors placed as close as possible to the device's power pins. This helps to filter out noise and reduce power supply ripple.