Part Details for CPH6444-TL-W by onsemi
Results Overview of CPH6444-TL-W by onsemi
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Audio and Video Systems
CPH6444-TL-W Information
CPH6444-TL-W by onsemi is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for CPH6444-TL-W
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
CPH6444-TL-W
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Avnet Silica | Trans MOSFET NCH 60V 45A 6Pin CPH TR (Alt: CPH6444-TL-W) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
CPH6444-TL-W
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EBV Elektronik | Trans MOSFET NCH 60V 45A 6Pin CPH TR (Alt: CPH6444-TL-W) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for CPH6444-TL-W
CPH6444-TL-W CAD Models
CPH6444-TL-W Part Data Attributes
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CPH6444-TL-W
onsemi
Buy Now
Datasheet
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Compare Parts:
CPH6444-TL-W
onsemi
N-Channel Power MOSFET, 60V, 4.5A, 78mΩ, CPH6, 3000-REEL
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| Pbfree Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ONSEMI | |
| Part Package Code | CPH6 | |
| Pin Count | 6 | |
| Manufacturer Package Code | 318BD | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | onsemi | |
| JESD-609 Code | e6 | |
| Moisture Sensitivity Level | 1 | |
| Peak Reflow Temperature (Cel) | 260 | |
| Terminal Finish | Tin/Bismuth (Sn/Bi) | |
| Time@Peak Reflow Temperature-Max (s) | 30 |
CPH6444-TL-W Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
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Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
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Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Avoid wave soldering and hand soldering.
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Yes, but ensure the device is properly sealed and conformal coated to prevent moisture ingress. Follow IPC-J-STD-001 guidelines for moisture-sensitive devices.
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Use a systematic approach: 1) Verify power supply and input signals, 2) Check for thermal issues, 3) Analyze output waveforms, and 4) Consult the datasheet and application notes.