Datasheets
CPC5902G by:

Analog Circuit, 1 Func, PDIP8, DIP-8

Part Details for CPC5902G by IXYS Corporation

Results Overview of CPC5902G by IXYS Corporation

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Applications Industrial Automation Smart Cities

CPC5902G Information

CPC5902G by IXYS Corporation is an Other Signal Circuit.
Other Signal Circuits are under the broader part category of Signal Circuits.

A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.

Price & Stock for CPC5902G

Part # Distributor Description Stock Price Buy
New Advantage Corporation IC-5902 OPTOISO BUS REPEATER DIP8 RoHS: Compliant Min Qty: 1 Package Multiple: 100 611
  • 100 $10.1300
  • 611 $9.3600
$9.3600 / $10.1300 Buy Now

Part Details for CPC5902G

CPC5902G CAD Models

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CPC5902G Part Data Attributes

CPC5902G IXYS Corporation
Buy Now Datasheet
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CPC5902G IXYS Corporation Analog Circuit, 1 Func, PDIP8, DIP-8
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer IXYS CORP
Part Package Code DIP
Package Description DIP-8
Pin Count 8
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Additional Feature SEATED HGT-NOM
Analog IC - Other Type ANALOG CIRCUIT
JESD-30 Code R-PDIP-T8
Length 9.652 mm
Number of Functions 1
Number of Terminals 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Peak Reflow Temperature (Cel) 250
Seated Height-Max 4.064 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount NO
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 10
Width 7.62 mm

CPC5902G Related Parts

CPC5902G Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad with a minimum size of 1 inch x 1 inch, and using multiple vias to connect the thermal pad to a solid copper plane on the bottom layer of the PCB. This helps to dissipate heat efficiently and reduce thermal resistance.

  • To ensure reliable operation in high-temperature environments, it is recommended to derate the device's power handling capability according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat sinking to keep the device junction temperature below the maximum rated value.

  • The recommended gate drive circuit for CPC5902G involves using a gate driver IC with a high current capability (e.g. IX4420) and a gate resistor (e.g. 10 ohms) to ensure fast switching times and minimize ringing. The gate drive voltage should be set to 15V to ensure reliable turn-on and turn-off.

  • To protect the device from overvoltage and overcurrent conditions, it is recommended to use a voltage clamp circuit (e.g. a zener diode and a resistor) to limit the voltage across the device, and a current sense resistor to monitor the current through the device. Additionally, consider using a fuse or a current limiter to prevent excessive current flow.

  • The recommended storage and handling procedure for CPC5902G involves storing the devices in their original packaging or in a dry, ESD-protected environment. Avoid touching the device pins or exposing them to moisture, and handle the devices by the body only to prevent ESD damage.

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