Part Details for CPC5621ATR by IXYS Integrated Circuits Division
Results Overview of CPC5621ATR by IXYS Integrated Circuits Division
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CPC5621ATR Information
CPC5621ATR by IXYS Integrated Circuits Division is a Modem.
Modems are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for CPC5621ATR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
|
Win Source Electronics | IC LITELINK III FULL RING 32SOIC | 460 |
|
$36.7034 / $55.0549 | Buy Now |
Part Details for CPC5621ATR
CPC5621ATR CAD Models
CPC5621ATR Part Data Attributes
|
|
CPC5621ATR
IXYS Integrated Circuits Division
Buy Now
Datasheet
|
Compare Parts:
CPC5621ATR
IXYS Integrated Circuits Division
IC MODEM-SUPPORT CIRCUIT, PDSO32, ROHS COMPLIANT, SOIC-32, Modem
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | IXYS INTEGRATED CIRCUITS DIVISION | |
| Part Package Code | SOIC | |
| Package Description | SSOP, SSOP32,.4 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e3 | |
| Length | 10.287 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SSOP | |
| Package Equivalence Code | SSOP32,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, SHRINK PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.134 mm | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | MODEM-SUPPORT CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Width | 7.493 mm |
CPC5621ATR Frequently Asked Questions (FAQ)
-
A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
-
Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below the maximum rating. Monitor the device's thermal resistance (RθJA) and ensure it is within the specified range.
-
The CPC5621ATR has an internal ESD protection diode, but it is recommended to add external ESD protection devices, such as TVS diodes, to protect the device from electrostatic discharge. Follow the manufacturer's guidelines for ESD protection and handling.
-
The CPC5621ATR is a commercial-grade device, but it can be used in high-reliability or aerospace applications with proper qualification and testing. Consult with the manufacturer and follow relevant industry standards, such as MIL-STD-883 or NASA's Electronic Parts and Packaging (EPP) program.
-
Use a systematic approach to troubleshoot issues, starting with visual inspection of the device and PCB. Check for signs of overheating, electrical overstress, or physical damage. Use oscilloscopes and other diagnostic tools to analyze the device's behavior and identify the root cause of the issue.