Part Details for CPC5621A by IXYS Corporation
Results Overview of CPC5621A by IXYS Corporation
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CPC5621A Information
CPC5621A by IXYS Corporation is a Modem.
Modems are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for CPC5621A
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | IC,DATA ACCESS ARRANGEMENT (DAA),SSOP,32PIN,PLASTIC | 18 |
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$4.2956 / $6.4434 | Buy Now |
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Velocity Electronics | Our Stock | 7 |
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RFQ |
Part Details for CPC5621A
CPC5621A CAD Models
CPC5621A Part Data Attributes
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CPC5621A
IXYS Corporation
Buy Now
Datasheet
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Compare Parts:
CPC5621A
IXYS Corporation
Modem-Support Circuit, PDSO32, ROHS COMPLIANT, SOIC-32
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | IXYS CORP | |
| Part Package Code | SOIC | |
| Package Description | SOIC-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e3 | |
| Length | 10.287 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SSOP | |
| Package Equivalence Code | SSOP32,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, SHRINK PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.134 mm | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | MODEM-SUPPORT CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Width | 7.493 mm |
CPC5621A Frequently Asked Questions (FAQ)
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A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
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Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device, and ensure that the PCB design allows for adequate heat dissipation.
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The CPC5621A has internal ESD protection, but it is still recommended to follow standard ESD handling procedures when handling the device. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
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The CPC5621A is a commercial-grade device, but it can be used in high-reliability or aerospace applications with proper qualification and testing. Consult with IXYS Corporation or a qualified reliability engineer to determine the suitability of the device for your specific application.
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Consult the datasheet and application notes for troubleshooting guidelines. Common issues include overheating, incorrect biasing, or improper PCB layout. Use a logic analyzer or oscilloscope to debug the device's operation and identify potential issues.