Datasheets
CPC5620ATR by:

Modem-Support Circuit, PDSO32, ROHS COMPLIANT, SOIC-32

Part Details for CPC5620ATR by IXYS Corporation

Results Overview of CPC5620ATR by IXYS Corporation

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CPC5620ATR Information

CPC5620ATR by IXYS Corporation is a Modem.
Modems are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for CPC5620ATR

Part # Distributor Description Stock Price Buy
Vyrian Telecommunications 8923
RFQ

Part Details for CPC5620ATR

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CPC5620ATR Part Data Attributes

CPC5620ATR IXYS Corporation
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CPC5620ATR IXYS Corporation Modem-Support Circuit, PDSO32, ROHS COMPLIANT, SOIC-32
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer IXYS CORP
Part Package Code SOIC
Package Description SOIC-32
Pin Count 32
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Additional Feature IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY
JESD-30 Code R-PDSO-G32
JESD-609 Code e3
Length 10.287 mm
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 32
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code SSOP
Package Equivalence Code SSOP32,.4
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH
Qualification Status Not Qualified
Seated Height-Max 2.134 mm
Supply Current-Max 0.01 mA
Supply Voltage-Nom 3.3 V
Surface Mount YES
Telecom IC Type MODEM-SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.635 mm
Terminal Position DUAL
Width 7.493 mm

CPC5620ATR Related Parts

CPC5620ATR Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the device, using a minimum of 2 oz copper thickness, and ensuring good thermal conduction to the surrounding copper area. A thermal via array can also be used to improve heat dissipation.

  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device, ensure good thermal management, and consider using a heat sink or thermal interface material to reduce the junction temperature.

  • The CPC5620ATR has an internal ESD protection diode, but it is still recommended to follow standard ESD handling procedures when handling the device. Additionally, it is recommended to use an external ESD protection device, such as a TVS diode, to protect the device from external ESD events.

  • Yes, the CPC5620ATR can be used in high-frequency applications up to 100 kHz. However, it is essential to consider the device's parasitic capacitance and inductance, as well as the PCB layout, to ensure optimal performance at high frequencies.

  • The CPC5620ATR should be stored in a dry, cool place, away from direct sunlight and moisture. It is recommended to store the device in its original packaging or in a sealed bag with desiccant to prevent moisture absorption. Handling should be done with anti-static wrist straps or mats to prevent ESD damage.

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