Part Details for CPC5620A by IXYS Corporation
Results Overview of CPC5620A by IXYS Corporation
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CPC5620A Information
CPC5620A by IXYS Corporation is a Modem.
Modems are under the broader part category of Telecommunication Circuits.
A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.
Price & Stock for CPC5620A
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
849-CPC5620A
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Mouser Electronics | Telecom Interface ICs LITELINK III Phone Line Int IC RoHS: Compliant | 0 |
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Order Now | |
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Onlinecomponents.com | Phone Line Interface IC - Parallel Interface - 32-Pin SOIC - Tube RoHS: Compliant |
57 In Stock |
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$2.4100 / $3.9000 | Buy Now |
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|
Vyrian | Telecommunications | 54 |
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RFQ |
Part Details for CPC5620A
CPC5620A CAD Models
CPC5620A Part Data Attributes
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CPC5620A
IXYS Corporation
Buy Now
Datasheet
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CPC5620A
IXYS Corporation
Modem-Support Circuit, PDSO32, ROHS COMPLIANT, SOIC-32
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | IXYS CORP | |
| Part Package Code | SOIC | |
| Package Description | SOIC-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | IT CAN ALSO OPERATE WITH 5V NOMINAL SUPPLY | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e3 | |
| Length | 10.287 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SSOP | |
| Package Equivalence Code | SSOP32,.4 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, SHRINK PITCH | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.134 mm | |
| Supply Current-Max | 0.01 mA | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Telecom IC Type | MODEM-SUPPORT CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.635 mm | |
| Terminal Position | DUAL | |
| Width | 7.493 mm |
CPC5620A Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing the CPC5620A near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A minimum of 2 oz copper thickness is recommended, and thermal vias should be used to dissipate heat efficiently.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the CPC5620A. Additionally, the device should be mounted on a heat sink or thermal pad, and the PCB should be designed to minimize thermal resistance. It is also crucial to ensure that the device is operated within its specified temperature range.
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The CPC5620A has an internal ESD protection diode, but it is still recommended to follow standard ESD handling procedures when handling the device. The device should be stored in an ESD-protected environment, and handlers should wear ESD-protective wrist straps or clothing. During PCB assembly, ESD-protective materials should be used to prevent damage to the device.
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The CPC5620A is designed for low-frequency applications, and its performance may degrade at high frequencies. However, it can be used in high-frequency applications with proper PCB design and layout. The device's parasitic capacitance and inductance should be minimized, and the PCB should be designed to reduce electromagnetic interference (EMI).
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The recommended soldering conditions for the CPC5620A involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. The device should be soldered in a nitrogen atmosphere to prevent oxidation, and the soldering iron should be kept clean and well-tinned to prevent damage to the device.