Part Details for CPC5602C by IXYS Corporation
Results Overview of CPC5602C by IXYS Corporation
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CPC5602C Information
CPC5602C by IXYS Corporation is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for CPC5602C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 183 |
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RFQ |
Part Details for CPC5602C
CPC5602C CAD Models
CPC5602C Part Data Attributes
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CPC5602C
IXYS Corporation
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Datasheet
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CPC5602C
IXYS Corporation
Power Field-Effect Transistor, 0.005A I(D), 350V, 14ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT PACKAGE-4
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | IXYS CORP | |
| Package Description | ROHS COMPLIANT PACKAGE-4 | |
| Pin Count | 4 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Additional Feature | HIGH RELIABILITY | |
| Case Connection | DRAIN | |
| Configuration | SINGLE | |
| DS Breakdown Voltage-Min | 350 V | |
| Drain Current-Max (ID) | 0.005 A | |
| Drain-source On Resistance-Max | 14 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PDSO-G4 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| Operating Mode | DEPLETION MODE | |
| Operating Temperature-Max | 85 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 2.5 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
Alternate Parts for CPC5602C
This table gives cross-reference parts and alternative options found for CPC5602C. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CPC5602C, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| CPC5602CTR | Littelfuse Inc | $0.7778 | Power Field-Effect Transistor, 0.005A I(D), 350V, 14ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT PACKAGE-4 | CPC5602C vs CPC5602CTR |
CPC5602C Frequently Asked Questions (FAQ)
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The recommended PCB layout for optimal thermal performance involves placing the CPC5602C near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A minimum of 2 oz copper thickness is recommended, and thermal vias should be used to dissipate heat efficiently.
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To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the CPC5602C. Additionally, the device should be mounted on a heat sink or thermal pad, and the PCB should be designed to minimize thermal resistance. It is also crucial to ensure that the device is operated within its specified maximum junction temperature (Tj) of 150°C.
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The recommended soldering conditions for the CPC5602C involve using a soldering iron with a temperature of 250°C to 260°C, and a soldering time of 3 to 5 seconds. The device should be soldered using a solder with a melting point of 180°C to 220°C, and the PCB should be preheated to 100°C to 120°C to prevent thermal shock.
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To protect the CPC5602C from electrical overstress (EOS) and electrostatic discharge (ESD), it is essential to follow proper handling and storage procedures. The device should be handled in an ESD-protected environment, and ESD protection devices such as TVS diodes or ESD suppressors should be used in the circuit design. Additionally, the device should be operated within its specified maximum ratings, and overvoltage protection circuits should be used to prevent EOS.
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The recommended storage and handling procedures for the CPC5602C involve storing the devices in their original packaging or in a dry, ESD-protected environment. The devices should be handled using ESD-protected tools and equipment, and should not be exposed to temperatures above 30°C or humidity above 60%. The devices should also be protected from physical damage and contamination.