Part Details for CPC1301GR by IXYS Integrated Circuits Division
Results Overview of CPC1301GR by IXYS Integrated Circuits Division
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CPC1301GR Information
CPC1301GR by IXYS Integrated Circuits Division is an Optocoupler.
Optocoupler are under the broader part category of Optoelectronics.
Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.
Price & Stock for CPC1301GR
Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | OPTOISOLTR 5KV DARLINGTON 4-SMD / Optoisolator Darlington Output 5000Vrms 1 Channel 4-SMD | 1000 |
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$1.0055 / $1.5082 | Buy Now |
Part Details for CPC1301GR
CPC1301GR CAD Models
CPC1301GR Part Data Attributes
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CPC1301GR
IXYS Integrated Circuits Division
Buy Now
Datasheet
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CPC1301GR
IXYS Integrated Circuits Division
Optocoupler - Transistor Output, 1 CHANNEL DARLINGTON OUTPUT OPTOCOUPLER, ROHS COMPLIANT PACKAGE-4
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | IXYS INTEGRATED CIRCUITS DIVISION | |
Reach Compliance Code | unknown | |
HTS Code | 8541.40.80.00 | |
Additional Feature | UL RECOGNIZED | |
Coll-Emtr Bkdn Voltage-Min | 350 V | |
Configuration | SINGLE | |
Current Transfer Ratio-Nom | 5500% | |
Dark Current-Max | 100 nA | |
Forward Current-Max | 0.05 A | |
Isolation Voltage-Max | 5000 V | |
JESD-609 Code | e3 | |
Number of Elements | 1 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Optoelectronic Device Type | DARLINGTON OUTPUT OPTOCOUPLER | |
Terminal Finish | Matte Tin (Sn) |
CPC1301GR Frequently Asked Questions (FAQ)
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A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
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Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to keep the device temperature below 125°C. Monitor the device's thermal resistance (RθJA) and adjust the system design accordingly.
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The CPC1301GR has an internal ESD protection diode, but it is recommended to add external ESD protection, such as a TVS diode, to protect the device from electrostatic discharge. Follow the manufacturer's guidelines for ESD handling and storage.
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The CPC1301GR is a commercial-grade device, but it can be used in high-reliability applications with proper derating and qualification. Consult with IXYS Corporation for specific guidance on using the CPC1301GR in aerospace or high-reliability applications.
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Use a systematic approach to troubleshoot issues, starting with visual inspection of the PCB and device. Check for proper soldering, PCB damage, and component damage. Use oscilloscopes and logic analyzers to diagnose signal integrity issues. Consult the datasheet and application notes for guidance on troubleshooting specific issues.