Datasheets
CLV1310A-LF by: Z-Communications Inc

Oscillator, 1260MHz Min, 1370MHz Max, 1370MHz Nom

Part Details for CLV1310A-LF by Z-Communications Inc

Results Overview of CLV1310A-LF by Z-Communications Inc

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Applications Internet of Things (IoT) Environmental Monitoring Industrial Automation Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

CLV1310A-LF Information

CLV1310A-LF by Z-Communications Inc is an Other Oscillator.
Other Oscillators are under the broader part category of Oscillators.

Oscillators are electronic components that produce sine or square waves in order to convert signals. Read more about Oscillators on our Oscillators part category page.

Price & Stock for CLV1310A-LF

Part # Distributor Description Stock Price Buy
Bristol Electronics   5
RFQ

Part Details for CLV1310A-LF

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CLV1310A-LF Part Data Attributes

CLV1310A-LF Z-Communications Inc
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CLV1310A-LF Z-Communications Inc Oscillator, 1260MHz Min, 1370MHz Max, 1370MHz Nom
Rohs Code Yes
Part Life Cycle Code Contact Manufacturer
Ihs Manufacturer Z-COMMUNICATIONS INC
Reach Compliance Code compliant
Mounting Feature SURFACE MOUNT
Number of Terminals 14
Operating Frequency-Max 1370 MHz
Operating Frequency-Min 1260 MHz
Operating Frequency-Nom 1370 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material METAL
Package Equivalence Code LCC14(UNSPEC)
Qualification Status Not Qualified
Supply Current-Max 30 mA
Supply Voltage-Nom 5 V
Surface Mount YES

CLV1310A-LF Related Parts

CLV1310A-LF Frequently Asked Questions (FAQ)

  • A good PCB layout and grounding scheme is crucial for optimal performance. It is recommended to use a multi-layer PCB with a solid ground plane, and to keep the signal traces as short as possible. The device should be placed close to the antenna, and the antenna should be matched to the device's output impedance. A good rule of thumb is to use a star-grounding scheme, where all grounds are connected to a single point, and to avoid running signal traces near the edges of the board.

  • To ensure proper biasing and configuration, it is recommended to follow the application circuit shown in the datasheet, and to use the recommended component values. The device requires a single 5V power supply, and the biasing resistors should be chosen to set the desired output power and frequency. Additionally, the device has several control pins that can be used to configure the device for different modes of operation, such as frequency modulation or amplitude modulation.

  • The typical output power of the CLV1310A-LF is +13 dBm, with a frequency stability of ±10 ppm over the operating temperature range of -40°C to +85°C. The device is designed to operate at a frequency of 1310 MHz, but the frequency can be adjusted by using an external voltage-controlled oscillator (VCO) or by using the device's internal VCO and adjusting the control voltage.

  • To troubleshoot common issues, it is recommended to first check the power supply voltage and ensure it is within the recommended range. Next, check the biasing resistors and ensure they are properly set. If the issue persists, check the device's control pins and ensure they are properly configured. If the issue is still not resolved, it may be necessary to use a spectrum analyzer or other test equipment to diagnose the problem. In some cases, it may be necessary to contact Z-Communications Inc for further assistance.

  • Yes, the CLV1310A-LF is a high-power device and requires proper thermal management to ensure reliable operation. The device has a maximum junction temperature of 150°C, and it is recommended to use a heat sink with a thermal resistance of less than 10°C/W. The heat sink should be attached to the device using a thermal interface material, and the device should be mounted on a PCB with a solid ground plane to help dissipate heat.

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