Part Details for CGHV31500F by MACOM
Results Overview of CGHV31500F by MACOM
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CGHV31500F Information
CGHV31500F by MACOM is an RF Power Field-Effect Transistor.
RF Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for CGHV31500F
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
1465-CGHV31500F-ND
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DigiKey | RF MOSFET HEMT 50V 440217 Min Qty: 1 Lead time: 26 Weeks Container: Tray |
106 In Stock |
|
$1,390.6900 | Buy Now |
|
DISTI #
941-CGHV31500F
|
Mouser Electronics | GaN FETs 500W, GaN HEMT, 50V, 2.7-3.1GHz, PULSED, | 20 |
|
$1,100.0400 | Buy Now |
|
DISTI #
CGHV31500F
|
Richardson RFPD | RF POWER TRANSISTOR RoHS: Compliant Min Qty: 1 | 0 |
|
$1,359.9700 | Buy Now |
Part Details for CGHV31500F
CGHV31500F CAD Models
CGHV31500F Part Data Attributes
CGHV31500F Frequently Asked Questions (FAQ)
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MACOM recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the device should be connected to a heat sink or a thermal management system.
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MACOM provides a reference design and application notes for input and output matching networks. Engineers can use simulation tools like ADS or AWR to optimize the matching networks for their specific application.
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MACOM recommends a sequential biasing scheme, with the drain voltage applied first, followed by the gate voltage. The recommended biasing conditions are Vd = 28V, Vg = 1.2V, and Idq = 200mA.
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MACOM recommends using ESD protection devices, such as TVS diodes, and overvoltage protection circuits, such as voltage regulators and zener diodes, to protect the device from ESD and overvoltage events.
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MACOM recommends using a forced-air cooling system or a liquid cooling system, depending on the power density and thermal requirements of the application. A heat sink with a thermal interface material (TIM) is also recommended.