Part Details for CBS05F30(TPL3) by Toshiba America Electronic Components
Results Overview of CBS05F30(TPL3) by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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CBS05F30(TPL3) Information
CBS05F30(TPL3) by Toshiba America Electronic Components is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Price & Stock for CBS05F30(TPL3)
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
757-CBS05F30TPL3
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Mouser Electronics | Schottky Diodes & Rectifiers Small Sig Schottky 0.5A 30V 0.45Vf RoHS: Compliant | 0 |
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$0.0600 / $0.4000 | Order Now |
Part Details for CBS05F30(TPL3)
CBS05F30(TPL3) CAD Models
CBS05F30(TPL3) Part Data Attributes
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CBS05F30(TPL3)
Toshiba America Electronic Components
Buy Now
Datasheet
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CBS05F30(TPL3)
Toshiba America Electronic Components
Small-Signal Schottky Barrier Diodes
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Reach Compliance Code | unknown | |
| Samacsys Manufacturer | Toshiba | |
| Application | GENERAL PURPOSE | |
| Configuration | SINGLE | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 0.45 V | |
| Non-rep Pk Forward Current-Max | 3 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Operating Temperature-Max | 125 °C | |
| Output Current-Max | 0.5 A | |
| Rep Pk Reverse Voltage-Max | 30 V | |
| Surface Mount | YES | |
| Technology | SCHOTTKY |
CBS05F30(TPL3) Frequently Asked Questions (FAQ)
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Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
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To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Toshiba also recommends derating the device's power dissipation according to the ambient temperature.
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Toshiba recommends soldering the CBS05F30(TPL3) using a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The device is also compatible with wave soldering and hand soldering, but specific temperature and time profiles should be followed to avoid damage.
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Yes, the CBS05F30(TPL3) is suitable for high-reliability and automotive applications. Toshiba provides a range of reliability and quality certifications, including AEC-Q101 and ISO/TS 16949. However, it's essential to consult with Toshiba's application engineers to ensure the device meets the specific requirements of your application.
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Toshiba recommends following standard ESD protection guidelines, including using ESD-sensitive handling and storage procedures, and incorporating ESD protection devices in the circuit design. The CBS05F30(TPL3) has an internal ESD protection diode, but external protection devices may still be necessary depending on the application.