Datasheets
CA91C142D-33CE by:

PBGA-313, Tray

Part Details for CA91C142D-33CE by Integrated Device Technology Inc

Results Overview of CA91C142D-33CE by Integrated Device Technology Inc

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Applications Industrial Automation Renewable Energy Robotics and Drones

CA91C142D-33CE Information

CA91C142D-33CE by Integrated Device Technology Inc is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for CA91C142D-33CE

Part # Distributor Description Stock Price Buy
Bristol Electronics   2
RFQ
Bristol Electronics   2
RFQ

Part Details for CA91C142D-33CE

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CA91C142D-33CE Part Data Attributes

CA91C142D-33CE Integrated Device Technology Inc
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CA91C142D-33CE Integrated Device Technology Inc PBGA-313, Tray
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code PBGA
Package Description 35 X 35 MM, PLASTIC, BGA-313
Pin Count 313
Manufacturer Package Code BG313
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Address Bus Width 64
Bus Compatibility PCI
Clock Frequency-Max 33 MHz
Data Transfer Rate-Max 70 MBps
External Data Bus Width 64
JESD-30 Code S-PBGA-B313
JESD-609 Code e0
Length 35 mm
Moisture Sensitivity Level 3
Number of Terminals 313
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY
Package Code IBGA
Package Equivalence Code BGA313,25X25,50
Package Shape SQUARE
Package Style GRID ARRAY, INTERSTITIAL PITCH
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 3.5 mm
Supply Voltage-Max 5.5 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 2.54 mm
Terminal Position BOTTOM
Width 35 mm
uPs/uCs/Peripheral ICs Type BUS CONTROLLER, VME

Alternate Parts for CA91C142D-33CE

This table gives cross-reference parts and alternative options found for CA91C142D-33CE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CA91C142D-33CE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
CA91C142D-33CEV Integrated Device Technology Inc $418.7983 PBGA-313, Tray CA91C142D-33CE vs CA91C142D-33CEV
CA91C142D-33IEV Integrated Device Technology Inc $530.6950 PBGA-313, Tray CA91C142D-33CE vs CA91C142D-33IEV
CA91C142D-33CEV Renesas Electronics Corporation $835.2515 VME to PCI Bridge, PBGA24/Tray CA91C142D-33CE vs CA91C142D-33CEV
CA91C142D-33IE Tundra Semiconductor Corp Check for Price VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313 CA91C142D-33CE vs CA91C142D-33IE
CA91C142D-33IE Renesas Electronics Corporation Check for Price VME to PCI Bridge, PBGA24/Tray CA91C142D-33CE vs CA91C142D-33IE

CA91C142D-33CE Related Parts

CA91C142D-33CE Frequently Asked Questions (FAQ)

  • A good PCB layout for the CA91C142D-33CE should prioritize signal integrity, minimize noise, and ensure proper power distribution. Use a 4-layer board with a solid ground plane, and keep high-speed signals away from the edges. Also, use a common mode filter or a ferrite bead to reduce EMI.

  • To ensure reliable operation across the entire temperature range (-40°C to 85°C), follow proper thermal management practices. Ensure good airflow, use a heat sink if necessary, and avoid overheating. Also, consider using thermal interface materials to improve heat transfer.

  • For the CA91C142D-33CE, use 50-ohm termination resistors for the differential pairs to ensure signal integrity and minimize reflections. You can also use a termination network with a 50-ohm resistor in series with a 100-nF capacitor to further improve signal quality.

  • To ensure proper power sequencing and voltage ramp-up, follow the recommended power-up sequence in the datasheet. Use a slow voltage ramp-up (e.g., 10 ms) to prevent damage to the device. Also, ensure that the power supply can provide the required current during startup.

  • For EMI shielding and grounding, use a metal shield around the device, and connect it to the chassis ground. Ensure that the PCB has a solid ground plane, and use a common mode filter or a ferrite bead to reduce EMI. Also, avoid running high-speed signals near the edges of the PCB.

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