Part Details for CA91C142D-33CE by Integrated Device Technology Inc
Results Overview of CA91C142D-33CE by Integrated Device Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
CA91C142D-33CE Information
CA91C142D-33CE by Integrated Device Technology Inc is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for CA91C142D-33CE
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 2 |
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RFQ | ||
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Bristol Electronics | 2 |
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RFQ |
Part Details for CA91C142D-33CE
CA91C142D-33CE CAD Models
CA91C142D-33CE Part Data Attributes
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CA91C142D-33CE
Integrated Device Technology Inc
Buy Now
Datasheet
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Compare Parts:
CA91C142D-33CE
Integrated Device Technology Inc
PBGA-313, Tray
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | PBGA | |
Package Description | 35 X 35 MM, PLASTIC, BGA-313 | |
Pin Count | 313 | |
Manufacturer Package Code | BG313 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Address Bus Width | 64 | |
Bus Compatibility | PCI | |
Clock Frequency-Max | 33 MHz | |
Data Transfer Rate-Max | 70 MBps | |
External Data Bus Width | 64 | |
JESD-30 Code | S-PBGA-B313 | |
JESD-609 Code | e0 | |
Length | 35 mm | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 313 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | IBGA | |
Package Equivalence Code | BGA313,25X25,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, INTERSTITIAL PITCH | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.5 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 2.54 mm | |
Terminal Position | BOTTOM | |
Width | 35 mm | |
uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, VME |
Alternate Parts for CA91C142D-33CE
This table gives cross-reference parts and alternative options found for CA91C142D-33CE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of CA91C142D-33CE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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CA91C142D-33CEV | Integrated Device Technology Inc | $418.7983 | PBGA-313, Tray | CA91C142D-33CE vs CA91C142D-33CEV |
CA91C142D-33IEV | Integrated Device Technology Inc | $530.6950 | PBGA-313, Tray | CA91C142D-33CE vs CA91C142D-33IEV |
CA91C142D-33CEV | Renesas Electronics Corporation | $835.2515 | VME to PCI Bridge, PBGA24/Tray | CA91C142D-33CE vs CA91C142D-33CEV |
CA91C142D-33IE | Tundra Semiconductor Corp | Check for Price | VME Bus Controller, CMOS, PBGA313, 35 X 35 MM, PLASTIC, BGA-313 | CA91C142D-33CE vs CA91C142D-33IE |
CA91C142D-33IE | Renesas Electronics Corporation | Check for Price | VME to PCI Bridge, PBGA24/Tray | CA91C142D-33CE vs CA91C142D-33IE |
CA91C142D-33CE Frequently Asked Questions (FAQ)
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A good PCB layout for the CA91C142D-33CE should prioritize signal integrity, minimize noise, and ensure proper power distribution. Use a 4-layer board with a solid ground plane, and keep high-speed signals away from the edges. Also, use a common mode filter or a ferrite bead to reduce EMI.
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To ensure reliable operation across the entire temperature range (-40°C to 85°C), follow proper thermal management practices. Ensure good airflow, use a heat sink if necessary, and avoid overheating. Also, consider using thermal interface materials to improve heat transfer.
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For the CA91C142D-33CE, use 50-ohm termination resistors for the differential pairs to ensure signal integrity and minimize reflections. You can also use a termination network with a 50-ohm resistor in series with a 100-nF capacitor to further improve signal quality.
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To ensure proper power sequencing and voltage ramp-up, follow the recommended power-up sequence in the datasheet. Use a slow voltage ramp-up (e.g., 10 ms) to prevent damage to the device. Also, ensure that the power supply can provide the required current during startup.
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For EMI shielding and grounding, use a metal shield around the device, and connect it to the chassis ground. Ensure that the PCB has a solid ground plane, and use a common mode filter or a ferrite bead to reduce EMI. Also, avoid running high-speed signals near the edges of the PCB.