Datasheets
C3P24D25C by:

Trigger Output SSR, 1-Channel, 2500V Isolation, SIP-8

Part Details for C3P24D25C by Teledyne Technologies Inc

Results Overview of C3P24D25C by Teledyne Technologies Inc

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C3P24D25C Information

C3P24D25C by Teledyne Technologies Inc is a Solid State Relay.
Solid State Relays are under the broader part category of Optoelectronics.

Optoelectronic components work to detect, generate, and control light. They can essentially produce and/or react to light. Read more about Optoelectronics on our Optoelectronics part category page.

Price & Stock for C3P24D25C

Part # Distributor Description Stock Price Buy
Onlinecomponents.com Relay SSR 30mA 10V DC-IN 25A 280V AC-OUT 8-Pin SIP 52 In Stock
  • 1 $243.1600
  • 5 $213.1700
  • 10 $211.0600
  • 17 $208.9700
  • 33 $206.9000
  • 50 $204.8500
  • 66 $202.8200
$202.8200 / $243.1600 Buy Now
Master Electronics Relay SSR 30mA 10V DC-IN 25A 280V AC-OUT 8-Pin SIP 52 In Stock
  • 1 $243.1600
  • 5 $213.1700
  • 10 $211.0600
  • 17 $208.9700
  • 33 $206.9000
  • 50 $204.8500
  • 66 $202.8200
$202.8200 / $243.1600 Buy Now

Part Details for C3P24D25C

C3P24D25C CAD Models

C3P24D25C Part Data Attributes

C3P24D25C Teledyne Technologies Inc
Buy Now Datasheet
Compare Parts:
C3P24D25C Teledyne Technologies Inc Trigger Output SSR, 1-Channel, 2500V Isolation, SIP-8
Part Life Cycle Code Active
Ihs Manufacturer TELEDYNE TECHNOLOGIES INC
Reach Compliance Code compliant
HTS Code 8541.40.95.00
Samacsys Manufacturer Teledyne Technologies
Additional Feature ZERO VOLTAGE CROSSING
Configuration SINGLE WITH BUILT-IN RESISTOR
Forward Current-Max 0.03 A
Isolation Voltage-Max 2500 V
Number of Elements 1
On-State Current-Max 25 A
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Optoelectronic Device Type TRIGGER OUTPUT SSR

C3P24D25C Related Parts

C3P24D25C Frequently Asked Questions (FAQ)

  • Teledyne recommends following a 4-layer PCB stackup with a dedicated thermal layer, and using thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended for the thermal layer. Additionally, a heat sink or thermal interface material can be used to further improve thermal management.

  • Teledyne recommends following the recommended mounting and screw torque specifications, and using a ruggedized PCB design with a low center of gravity. Additionally, consider using vibration-dampening materials or potting compounds to reduce the impact of vibrations on the device.

  • While the C3P24D25C is designed to be radiation-hardened, it's not immune to all types of radiation. Teledyne recommends consulting the radiation hardness assurance report (RHAR) for specific details on the device's tolerance to total ionizing dose (TID), single-event effects (SEE), and neutron-induced latchup. Custom radiation testing may be required for specific applications.

  • Yes, the C3P24D25C is designed to be compact, with a package size of 24-pin Ceramic Quad Flat Package (CQFP). However, Teledyne recommends verifying the device's thermal and power requirements to ensure reliable operation in space-constrained designs. Consider using thermal simulation tools and consulting with Teledyne's application engineers for guidance.

  • Teledyne recommends using a combination of tools, including logic analyzers, oscilloscopes, and debugging software. Consult the device's datasheet and application notes for specific troubleshooting guidelines. Additionally, Teledyne's application engineers and technical support team are available to provide assistance and guidance.

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