Part Details for C3D1P7060Q by Cree, Inc.
Results Overview of C3D1P7060Q by Cree, Inc.
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
C3D1P7060Q Information
C3D1P7060Q by Cree, Inc. is a Rectifier Diode.
Rectifier Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part Details for C3D1P7060Q
C3D1P7060Q CAD Models
C3D1P7060Q Part Data Attributes
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C3D1P7060Q
Cree, Inc.
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Datasheet
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C3D1P7060Q
Cree, Inc.
Rectifier Diode, Schottky, 1 Phase, 1 Element, 9.7A, 600V V(RRM), Silicon Carbide, 3.30 X 3.30 MM, HALOGEN FREE AND ROHS COMPLIANT, POWERQFN-8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | CREE INC | |
| Package Description | QFN-8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.10.00.80 | |
| Additional Feature | PD-CASE | |
| Application | EFFICIENCY | |
| Case Connection | CATHODE | |
| Configuration | SINGLE | |
| Diode Element Material | SILICON CARBIDE | |
| Diode Type | RECTIFIER DIODE | |
| Forward Voltage-Max (VF) | 1.7 V | |
| JESD-30 Code | S-PDSO-N3 | |
| Non-rep Pk Forward Current-Max | 12 A | |
| Number of Elements | 1 | |
| Number of Phases | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 160 °C | |
| Operating Temperature-Min | -55 °C | |
| Output Current-Max | 9.7 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Power Dissipation-Max | 35.5 W | |
| Rep Pk Reverse Voltage-Max | 600 V | |
| Reverse Current-Max | 15 µA | |
| Reverse Test Voltage | 600 V | |
| Surface Mount | YES | |
| Technology | SCHOTTKY | |
| Terminal Form | NO LEAD | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
C3D1P7060Q Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
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Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to maintain a safe operating temperature.
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A gate drive circuit with a voltage swing of 15-20V and a current capability of 1-2A is recommended. The gate drive circuit should also include a gate resistor (Rg) of 10-20 ohms to dampen oscillations.
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Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage from voltage spikes and excessive current. A fuse or circuit breaker can be used for OCP, while a zener diode or TVS diode can be used for OVP.
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Wire bonding with a 1-mil aluminum wire or a gold wire is recommended. For soldering, use a solder with a melting point above 260°C and follow the recommended soldering profile to prevent thermal damage.