Datasheets
BZV55-C3V6 by:

DIODE 3.6 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode

Part Details for BZV55-C3V6 by NXP Semiconductors

Results Overview of BZV55-C3V6 by NXP Semiconductors

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BZV55-C3V6 Information

BZV55-C3V6 by NXP Semiconductors is a Zener Diode.
Zener Diodes are under the broader part category of Diodes.

A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.

Price & Stock for BZV55-C3V6

Part # Distributor Description Stock Price Buy
Bristol Electronics   Min Qty: 34 2490
  • 34 $0.1500
  • 101 $0.0750
  • 668 $0.0450
$0.0450 / $0.1500 Buy Now
Win Source Electronics DIODE ZENER 3.6V 500MW SOD80C 655000
  • 2,440 $0.0237
  • 5,920 $0.0196
  • 9,205 $0.0189
  • 12,660 $0.0182
  • 16,340 $0.0177
  • 21,900 $0.0159
$0.0159 / $0.0237 Buy Now

Part Details for BZV55-C3V6

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BZV55-C3V6 Part Data Attributes

BZV55-C3V6 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
BZV55-C3V6 NXP Semiconductors DIODE 3.6 V, 0.4 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2, Voltage Regulator Diode
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Reach Compliance Code compliant
Samacsys Manufacturer NXP
Case Connection ISOLATED
Configuration SINGLE
Diode Element Material SILICON
Diode Type ZENER DIODE
Dynamic Impedance-Max 90 Ω
JESD-30 Code O-LELF-R2
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 200 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS
Package Shape ROUND
Package Style LONG FORM
Peak Reflow Temperature (Cel) 260
Polarity UNIDIRECTIONAL
Power Dissipation-Max 0.4 W
Qualification Status Not Qualified
Reference Voltage-Nom 3.6 V
Reverse Current-Max 5 µA
Surface Mount YES
Technology ZENER
Terminal Finish TIN
Terminal Form WRAP AROUND
Terminal Position END
Time@Peak Reflow Temperature-Max (s) 30
Voltage Temp Coeff-Max
Voltage Tol-Max 5%
Working Test Current 5 mA

Alternate Parts for BZV55-C3V6

This table gives cross-reference parts and alternative options found for BZV55-C3V6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BZV55-C3V6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
BZV55-C3V6,135 NXP Semiconductors Check for Price 3.6V, 0.4W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2 BZV55-C3V6 vs BZV55-C3V6,135
BZV55C3V6-T1 Sensitron Semiconductors Check for Price Zener Diode, 3.6V V(Z), 5.56%, 0.5W, Silicon, Unidirectional, GLASS, MINIMELF-2 BZV55-C3V6 vs BZV55C3V6-T1
BZV55C3V6 NXP Semiconductors Check for Price 3.6V, 0.4W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, HERMETIC SEALED, GLASS PACKAGE-2 BZV55-C3V6 vs BZV55C3V6

BZV55-C3V6 Related Parts

BZV55-C3V6 Frequently Asked Questions (FAQ)

  • The recommended operating temperature range for BZV55-C3V6 is -65°C to 175°C.

  • To ensure reliability, it's essential to follow the recommended derating curves for voltage and current, and to consider the device's thermal resistance and power dissipation.

  • Yes, BZV55-C3V6 can be used in switching regulator applications, but it's crucial to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range.

  • The maximum allowable power dissipation for BZV55-C3V6 is 1.5 W, but this value can be derated based on the operating temperature and other factors.

  • To prevent electrostatic discharge (ESD) damage, it's essential to follow proper handling and storage procedures, such as using ESD-safe materials and equipment, and ensuring that the device is properly grounded during assembly and testing.

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