Part Details for BUZ102AL by Siemens
Results Overview of BUZ102AL by Siemens
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BUZ102AL Information
BUZ102AL by Siemens is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BUZ102AL
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | 42 A, 50 V, 0.028 OHM, N-CHANNEL, SI, POWER, MOSFET, TO-220AB | 3104 |
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$0.3850 / $1.1000 | Buy Now |
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Quest Components | 42 A, 50 V, 0.028 OHM, N-CHANNEL, SI, POWER, MOSFET, TO-220AB | 1074 |
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$0.2750 / $0.6600 | Buy Now |
Part Details for BUZ102AL
BUZ102AL CAD Models
BUZ102AL Part Data Attributes
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BUZ102AL
Siemens
Buy Now
Datasheet
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BUZ102AL
Siemens
Power Field-Effect Transistor, 42A I(D), 50V, 0.028ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, TO-220, 3 PIN
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | SIEMENS A G | |
Part Package Code | SFM | |
Package Description | TO-220, 3 PIN | |
Pin Count | 3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8541.29.00.95 | |
Additional Feature | AVALANCHE RATED, LOGIC LEVEL COMPATIBLE | |
Avalanche Energy Rating (Eas) | 180 mJ | |
Configuration | SINGLE WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 50 V | |
Drain Current-Max (ID) | 42 A | |
Drain-source On Resistance-Max | 0.028 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
Feedback Cap-Max (Crss) | 360 pF | |
JEDEC-95 Code | TO-220AB | |
JESD-30 Code | R-PSFM-T3 | |
Number of Elements | 1 | |
Number of Terminals | 3 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 175 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | FLANGE MOUNT | |
Polarity/Channel Type | N-CHANNEL | |
Power Dissipation Ambient-Max | 200 W | |
Pulsed Drain Current-Max (IDM) | 168 A | |
Qualification Status | Not Qualified | |
Surface Mount | NO | |
Terminal Form | THROUGH-HOLE | |
Terminal Position | SINGLE | |
Transistor Element Material | SILICON | |
Turn-off Time-Max (toff) | 590 ns | |
Turn-on Time-Max (ton) | 250 ns |
BUZ102AL Frequently Asked Questions (FAQ)
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The maximum operating temperature range for the BUZ102AL is -40°C to 150°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures.
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To ensure proper thermal management, it's crucial to provide adequate heat sinking and cooling mechanisms. The BUZ102AL has a thermal resistance of 1.5 K/W, so a heat sink with a thermal resistance of less than 1.5 K/W is recommended. Additionally, ensure good airflow around the device and avoid thermal hotspots.
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For optimal performance and thermal management, it's recommended to follow a compact PCB layout with short leads and a solid ground plane. Place the device close to the heat sink, and ensure good thermal conductivity between the device and the heat sink. Avoid routing high-frequency signals near the device to minimize electromagnetic interference (EMI).
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When working with the BUZ102AL, it's essential to handle the device with care to avoid electrical shock and damage. Use proper safety equipment, such as insulated tools and a wrist strap, to prevent electrostatic discharge (ESD). Ensure the device is properly soldered and connected to the PCB to avoid electrical arcing and overheating.
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The BUZ102AL is a high-reliability device with a typical lifespan of 10-15 years, depending on operating conditions and environmental factors. However, it's essential to follow proper design, manufacturing, and testing procedures to ensure the device meets its expected lifespan. Regular maintenance and monitoring can also help extend the device's lifespan.