Part Details for BUX98 by STMicroelectronics
Results Overview of BUX98 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (5 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BUX98 Information
BUX98 by STMicroelectronics is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for BUX98
BUX98 CAD Models
BUX98 Part Data Attributes
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BUX98
STMicroelectronics
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Datasheet
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BUX98
STMicroelectronics
30A, 400V, NPN, Si, POWER TRANSISTOR, TO-3, TO-3, 2 PIN
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| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | TO-204AA | |
| Package Description | TO-3, 2 PIN | |
| Pin Count | 2 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.95 | |
| Case Connection | COLLECTOR | |
| Collector Current-Max (IC) | 30 A | |
| Collector-Emitter Voltage-Max | 400 V | |
| Configuration | SINGLE | |
| JEDEC-95 Code | TO-3 | |
| JESD-30 Code | O-MBFM-P2 | |
| Number of Elements | 1 | |
| Number of Terminals | 2 | |
| Operating Temperature-Max | 200 °C | |
| Package Body Material | METAL | |
| Package Shape | ROUND | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | NPN | |
| Power Dissipation Ambient-Max | 250 W | |
| Power Dissipation-Max (Abs) | 250 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Position | BOTTOM | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON | |
| Turn-off Time-Max (toff) | 3800 ns | |
| Turn-on Time-Max (ton) | 1000 ns | |
| VCEsat-Max | 1.5 V |
Alternate Parts for BUX98
This table gives cross-reference parts and alternative options found for BUX98. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BUX98, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| BUX98 | Motorola Semiconductor Products | Check for Price | Power Bipolar Transistor, 30A I(C), 400V V(BR)CEO, 1-Element, NPN, Silicon, TO-204AE, Metal, 2 Pin | BUX98 vs BUX98 |
| BUX98.MODR1 | TT Electronics Power and Hybrid / Semelab Limited | Check for Price | 30A, 400V, NPN, Si, POWER TRANSISTOR, TO-3, TO-3, 2 PIN | BUX98 vs BUX98.MODR1 |
| BUS14 | TT Electronics Power and Hybrid / Semelab Limited | Check for Price | 30A, 400V, NPN, Si, POWER TRANSISTOR, TO-204AE, HERMETIC SEALED, METAL, TO-3, 2 PIN | BUX98 vs BUS14 |
| BUX98.MOD | TT Electronics Power and Hybrid / Semelab Limited | Check for Price | 30A, 400V, NPN, Si, POWER TRANSISTOR, TO-3, TO-3, 2 PIN | BUX98 vs BUX98.MOD |
| BUX98-QR-B | TT Electronics Power and Hybrid / Semelab Limited | Check for Price | 30A, 400V, NPN, Si, POWER TRANSISTOR, TO-3, TO-3, 2 PIN | BUX98 vs BUX98-QR-B |
BUX98 Frequently Asked Questions (FAQ)
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STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and storage temperature (Tstg). Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
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To minimize EMI and RFI, use a shielded enclosure, and ensure the BUX98 is placed away from noise sources. Use a ground plane on the PCB, and consider adding EMI filters or ferrite beads on the input and output lines. Additionally, follow good PCB layout practices, such as separating analog and digital circuits.
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To troubleshoot common issues, start by checking the PCB layout and thermal design. Verify that the device is operated within the recommended specifications, and check for any signs of physical damage or contamination. Use oscilloscopes and logic analyzers to debug the circuit, and consult the datasheet and application notes for guidance.
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STMicroelectronics recommends using a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 30 seconds. Use a solder paste with a melting point above 217°C (423°F), and ensure the PCB is designed with a solder mask to prevent bridging. Follow the recommended land pattern and soldering guidelines in the datasheet.