Part Details for BSS138NL6327 by Infineon Technologies AG
Results Overview of BSS138NL6327 by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BSS138NL6327 Information
BSS138NL6327 by Infineon Technologies AG is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BSS138NL6327
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 767 |
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RFQ | ||
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ComSIT USA | SIPMOS SMALL-SIGNAL-TRANSISTOR Small Signal Field-Effect Transistor, 0.23A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET ECCN: EAR99 RoHS: Compliant |
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RFQ | |
DISTI #
SP000074207
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EBV Elektronik | NKANAL SMALL SIGNAL MOS (Alt: SP000074207) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Vyrian | Transistors | 240 |
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RFQ | |
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Win Source Electronics | GaN FETs N-Ch 60V 230mA SOT-23-3 | 18660 |
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$0.1805 / $0.2708 | Buy Now |
Part Details for BSS138NL6327
BSS138NL6327 CAD Models
BSS138NL6327 Part Data Attributes
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BSS138NL6327
Infineon Technologies AG
Buy Now
Datasheet
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BSS138NL6327
Infineon Technologies AG
Small Signal Field-Effect Transistor, 0.23A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, PLASTIC PACKAGE-3
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | ROHS COMPLIANT, PLASTIC PACKAGE-3 | |
Pin Count | 3 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.21.00.95 | |
Additional Feature | LOGIC LEVEL COMPATIBLE | |
Configuration | SINGLE WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 60 V | |
Drain Current-Max (ID) | 0.23 A | |
Drain-source On Resistance-Max | 3.5 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
Feedback Cap-Max (Crss) | 3.8 pF | |
JESD-30 Code | R-PDSO-G3 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 3 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity/Channel Type | N-CHANNEL | |
Power Dissipation Ambient-Max | 0.36 W | |
Power Dissipation-Max (Abs) | 0.36 W | |
Qualification Status | Not Qualified | |
Reference Standard | AEC-Q101; IEC-61249-2-21 | |
Surface Mount | YES | |
Terminal Finish | Matte Tin (Sn) | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Transistor Element Material | SILICON |
BSS138NL6327 Frequently Asked Questions (FAQ)
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A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal vias as close as possible to the device can help to dissipate heat more efficiently.
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To ensure the device is properly biased, make sure to follow the recommended operating conditions outlined in the datasheet. This includes setting the input voltage within the recommended range, ensuring the output voltage is within the specified range, and providing a stable power supply. Additionally, ensure that the device is properly decoupled with capacitors to minimize noise and oscillations.
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When using the BSS138NL6327, key considerations for EMI and EMC include minimizing the loop area of the PCB traces, using a common mode choke or ferrite bead to reduce common mode noise, and ensuring that the device is properly shielded from external electromagnetic interference. Additionally, following good PCB design practices such as using a solid ground plane and minimizing the use of vias can help to reduce EMI and EMC issues.
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To troubleshoot issues with the BSS138NL6327, start by reviewing the datasheet and application notes to ensure that the device is being used within the recommended operating conditions. Check the power supply voltage, input signals, and output signals to ensure they are within the specified ranges. Use an oscilloscope to visualize the signals and identify any anomalies. If the issue persists, consider consulting with an Infineon support engineer or seeking assistance from a qualified electronics engineer.
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The BSS138NL6327 is a high-reliability device with a proven track record of quality and performance. Infineon Technologies AG follows a rigorous quality control process to ensure that the device meets or exceeds industry standards for reliability and quality. The device is also qualified according to the AEC-Q101 standard for automotive applications, ensuring that it meets the stringent requirements of the automotive industry.