Datasheets
BSS138NL6327 by: Infineon Technologies AG

Small Signal Field-Effect Transistor, 0.23A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, PLASTIC PACKAGE-3

Part Details for BSS138NL6327 by Infineon Technologies AG

Results Overview of BSS138NL6327 by Infineon Technologies AG

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BSS138NL6327 Information

BSS138NL6327 by Infineon Technologies AG is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for BSS138NL6327

Part # Distributor Description Stock Price Buy
Bristol Electronics   767
RFQ
ComSIT USA SIPMOS SMALL-SIGNAL-TRANSISTOR Small Signal Field-Effect Transistor, 0.23A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET ECCN: EAR99 RoHS: Compliant Stock DE - 11550
Stock ES - 546
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ
DISTI # SP000074207
EBV Elektronik NKANAL SMALL SIGNAL MOS (Alt: SP000074207) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days EBV - 0
Buy Now
Vyrian Transistors 240
RFQ
Win Source Electronics GaN FETs N-Ch 60V 230mA SOT-23-3 18660
  • 125 $0.2708
  • 305 $0.2222
  • 465 $0.2153
  • 640 $0.2083
  • 830 $0.2014
  • 1,110 $0.1805
$0.1805 / $0.2708 Buy Now

Part Details for BSS138NL6327

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BSS138NL6327 Part Data Attributes

BSS138NL6327 Infineon Technologies AG
Buy Now Datasheet
Compare Parts:
BSS138NL6327 Infineon Technologies AG Small Signal Field-Effect Transistor, 0.23A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, ROHS COMPLIANT, PLASTIC PACKAGE-3
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description ROHS COMPLIANT, PLASTIC PACKAGE-3
Pin Count 3
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.21.00.95
Additional Feature LOGIC LEVEL COMPATIBLE
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 60 V
Drain Current-Max (ID) 0.23 A
Drain-source On Resistance-Max 3.5 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 3.8 pF
JESD-30 Code R-PDSO-G3
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation Ambient-Max 0.36 W
Power Dissipation-Max (Abs) 0.36 W
Qualification Status Not Qualified
Reference Standard AEC-Q101; IEC-61249-2-21
Surface Mount YES
Terminal Finish Matte Tin (Sn)
Terminal Form GULL WING
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 40
Transistor Element Material SILICON

BSS138NL6327 Related Parts

BSS138NL6327 Frequently Asked Questions (FAQ)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Additionally, keeping the thermal vias as close as possible to the device can help to dissipate heat more efficiently.

  • To ensure the device is properly biased, make sure to follow the recommended operating conditions outlined in the datasheet. This includes setting the input voltage within the recommended range, ensuring the output voltage is within the specified range, and providing a stable power supply. Additionally, ensure that the device is properly decoupled with capacitors to minimize noise and oscillations.

  • When using the BSS138NL6327, key considerations for EMI and EMC include minimizing the loop area of the PCB traces, using a common mode choke or ferrite bead to reduce common mode noise, and ensuring that the device is properly shielded from external electromagnetic interference. Additionally, following good PCB design practices such as using a solid ground plane and minimizing the use of vias can help to reduce EMI and EMC issues.

  • To troubleshoot issues with the BSS138NL6327, start by reviewing the datasheet and application notes to ensure that the device is being used within the recommended operating conditions. Check the power supply voltage, input signals, and output signals to ensure they are within the specified ranges. Use an oscilloscope to visualize the signals and identify any anomalies. If the issue persists, consider consulting with an Infineon support engineer or seeking assistance from a qualified electronics engineer.

  • The BSS138NL6327 is a high-reliability device with a proven track record of quality and performance. Infineon Technologies AG follows a rigorous quality control process to ensure that the device meets or exceeds industry standards for reliability and quality. The device is also qualified according to the AEC-Q101 standard for automotive applications, ensuring that it meets the stringent requirements of the automotive industry.

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