Datasheets
BSS138NH6327 by:

Small Signal Field-Effect Transistor, 0.23A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3

Part Details for BSS138NH6327 by Infineon Technologies AG

Results Overview of BSS138NH6327 by Infineon Technologies AG

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BSS138NH6327 Information

BSS138NH6327 by Infineon Technologies AG is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for BSS138NH6327

Part # Distributor Description Stock Price Buy
Bristol Electronics   Min Qty: 20 1956
  • 20 $0.2625
  • 59 $0.1313
  • 382 $0.0788
  • 1,905 $0.0525
$0.0525 / $0.2625 Buy Now
Quest Components SMALL SIGNAL FIELD-EFFECT TRANSISTOR, 0.23A I(D), 60V, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET 15160
  • 1 $0.1500
  • 534 $0.0675
  • 2,964 $0.0488
$0.0488 / $0.1500 Buy Now
Quest Components SMALL SIGNAL FIELD-EFFECT TRANSISTOR, 0.23A I(D), 60V, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET 3959
  • 1 $0.6500
  • 616 $0.2600
  • 3,078 $0.2275
$0.2275 / $0.6500 Buy Now
Quest Components SMALL SIGNAL FIELD-EFFECT TRANSISTOR, 0.23A I(D), 60V, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET 1564
  • 1 $0.3500
  • 58 $0.1050
  • 477 $0.0700
$0.0700 / $0.3500 Buy Now
ComSIT USA SIPMOS SMALL-SIGNAL-TRANSISTOR Small Signal Field-Effect Transistor, 0.23A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET ECCN: EAR99 RoHS: Compliant Stock DE - 10145
Stock ES - 5956
Stock US - 1580
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ
NexGen Digital   1
RFQ
Chip 1 Exchange INSTOCK 4998
RFQ
Vyrian Transistors 139842
RFQ

Part Details for BSS138NH6327

BSS138NH6327 CAD Models

BSS138NH6327 Part Data Attributes

BSS138NH6327 Infineon Technologies AG
Buy Now Datasheet
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BSS138NH6327 Infineon Technologies AG Small Signal Field-Effect Transistor, 0.23A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC PACKAGE-3
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description GREEN, PLASTIC PACKAGE-3
Pin Count 3
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.21.00.95
Factory Lead Time 53 Weeks, 1 Day
Samacsys Manufacturer Infineon
Additional Feature LOGIC LEVEL COMPATIBLE
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 60 V
Drain Current-Max (ID) 0.23 A
Drain-source On Resistance-Max 3.5 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 3.8 pF
JESD-30 Code R-PDSO-G3
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation Ambient-Max 0.36 W
Power Dissipation-Max (Abs) 0.36 W
Qualification Status Not Qualified
Reference Standard AEC-Q101; IEC-61249-2-21
Surface Mount YES
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30
Transistor Element Material SILICON

BSS138NH6327 Related Parts

BSS138NH6327 Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the BSS138NH6327 is -40°C to 150°C.

  • To ensure proper biasing, connect the gate to a voltage source through a resistor, and connect the source to ground through a resistor. The recommended bias voltage is typically between 2.5V to 5V.

  • The maximum current rating for the BSS138NH6327 is 3.8A, but it's recommended to derate the current based on the operating temperature and PCB design.

  • To protect the BSS138NH6327 from ESD, use ESD-safe handling and storage procedures, and consider adding ESD protection devices such as TVS diodes or ESD arrays to the PCB design.

  • For optimal thermal management, use a thermal pad on the PCB, and ensure good thermal conductivity between the device and the PCB. Keep the PCB layout compact and symmetrical to minimize thermal gradients.

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