Datasheets
BSS138BKW by:

320mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, PLASTIC, SC-70, 3 PIN

Part Details for BSS138BKW by NXP Semiconductors

Results Overview of BSS138BKW by NXP Semiconductors

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BSS138BKW Information

BSS138BKW by NXP Semiconductors is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for BSS138BKW

Part # Distributor Description Stock Price Buy
ComSIT USA 60 V, 320 MILLI AMP N-CHANNEL TRENCH MOSFET Small Signal Field-Effect Transistor, 0.32A I(D), 60V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET ECCN: EAR99 RoHS: Compliant Stock DE - 2275
Stock ES - 0
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ
Vyrian Transistors 16550
RFQ
Win Source Electronics 60 V, 320 mA N-channel Trench MOSFET 120000
  • 1,555 $0.0372
  • 3,315 $0.0349
  • 5,155 $0.0336
  • 7,385 $0.0313
  • 9,620 $0.0300
  • 12,000 $0.0289
$0.0289 / $0.0372 Buy Now

Part Details for BSS138BKW

BSS138BKW CAD Models

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BSS138BKW Part Data Attributes

BSS138BKW NXP Semiconductors
Buy Now Datasheet
Compare Parts:
BSS138BKW NXP Semiconductors 320mA, 60V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, PLASTIC, SC-70, 3 PIN
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SC-70
Package Description PLASTIC, SC-70, 3 PIN
Pin Count 3
Reach Compliance Code unknown
ECCN Code EAR99
Samacsys Manufacturer NXP
Additional Feature LOGIC LEVEL COMPATIBLE
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 60 V
Drain Current-Max (ID) 0.32 A
Drain-source On Resistance-Max 1.6 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JESD-30 Code R-PDSO-G3
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Polarity/Channel Type N-CHANNEL
Surface Mount YES
Terminal Finish Tin (Sn)
Terminal Form GULL WING
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transistor Application SWITCHING
Transistor Element Material SILICON

Alternate Parts for BSS138BKW

This table gives cross-reference parts and alternative options found for BSS138BKW. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BSS138BKW, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
BSS138BKW,115 NXP Semiconductors Check for Price BSS138BKW - 60 V, 320 mA N-channel Trench MOSFET SC-70 3-Pin BSS138BKW vs BSS138BKW,115

BSS138BKW Related Parts

BSS138BKW Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the BSS138BKW is -55°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.

  • To ensure proper biasing, make sure to provide a stable voltage supply to the gate-source voltage (VGS) within the recommended range of 1.5V to 5V. Additionally, ensure the drain-source voltage (VDS) is within the recommended range of 0V to 50V. Proper biasing is critical for optimal performance, low power consumption, and high reliability.

  • For optimal thermal management, it's recommended to use a PCB layout with a large copper area connected to the drain pin to dissipate heat efficiently. Additionally, ensure good thermal conductivity between the device and the PCB by using a thermal interface material (TIM) or a thermal pad. A well-designed PCB layout and thermal management can help reduce thermal resistance and improve overall device performance.

  • To protect the BSS138BKW from ESD, handle the device with care, and use ESD-safe equipment and materials during assembly and testing. Ensure the device is stored in an ESD-safe environment, and use ESD protection devices such as TVS diodes or ESD protection arrays in the circuit design. Additionally, follow proper ESD handling procedures, such as grounding yourself before handling the device.

  • For optimal soldering, follow the recommended soldering conditions specified in the datasheet. The recommended soldering temperature is 260°C (peak temperature) with a soldering time of 10 seconds (max). Ensure the soldering process is done in a controlled environment with minimal thermal stress to prevent damage to the device.

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