Part Details for BSP89 by Infineon Technologies AG
Results Overview of BSP89 by Infineon Technologies AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (2 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BSP89 Information
BSP89 by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for BSP89
BSP89 CAD Models
BSP89 Part Data Attributes
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BSP89
Infineon Technologies AG
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Datasheet
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BSP89
Infineon Technologies AG
Power Field-Effect Transistor, 0.35A I(D), 240V, 6ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, SOT-223, 4 PIN
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | SOT-223 | |
| Package Description | SMALL OUTLINE, R-PDSO-G4 | |
| Pin Count | 4 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | Infineon | |
| Additional Feature | LOGIC LEVEL COMPATIBLE | |
| Case Connection | DRAIN | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 240 V | |
| Drain Current-Max (ID) | 0.35 A | |
| Drain-source On Resistance-Max | 6 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PDSO-G4 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 1.5 W | |
| Pulsed Drain Current-Max (IDM) | 1.4 A | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
Alternate Parts for BSP89
This table gives cross-reference parts and alternative options found for BSP89. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BSP89, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| BSP89,115 | Nexperia | $0.3537 | BSP89 - N-channel vertical D-MOS logic level FET@en-us SC-73 4-Pin | BSP89 vs BSP89,115 |
| BSP89 | NXP Semiconductors | Check for Price | TRANSISTOR 7.5 ohm, Si, POWER, FET, PLASTIC, SC-73, 4 PIN, FET General Purpose Power | BSP89 vs BSP89 |
BSP89 Frequently Asked Questions (FAQ)
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The maximum safe operating area (SOA) for the BSP89 is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and voltage ratings. As a general guideline, the SOA is typically limited by the device's thermal capabilities, and it's recommended to operate the device within the specified thermal boundaries to ensure reliable operation.
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To ensure the BSP89 is properly biased for optimal performance, it's essential to follow the recommended biasing conditions outlined in the datasheet. This includes setting the correct base-emitter voltage, collector-emitter voltage, and current levels. Additionally, it's crucial to consider the device's thermal characteristics, such as junction temperature and thermal resistance, to prevent overheating and ensure reliable operation.
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For optimal performance and reliability, it's recommended to follow good PCB layout practices, such as minimizing trace lengths, using wide traces for power connections, and providing adequate thermal vias and heat sinks. Additionally, consider the device's thermal resistance and maximum junction temperature when designing the PCB layout and thermal management system to prevent overheating and ensure reliable operation.
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Yes, the BSP89 can be used in switching applications, but it's essential to consider the device's switching characteristics, such as turn-on and turn-off times, and ensure that the device is properly biased and driven to prevent overheating and electrical overstress. Additionally, consider the device's maximum switching frequency, voltage ratings, and current capabilities to ensure reliable operation.
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To handle ESD protection for the BSP89, it's recommended to follow standard ESD protection practices, such as using ESD-sensitive handling and storage procedures, and incorporating ESD protection devices, such as TVS diodes or ESD protection arrays, into the circuit design. Additionally, consider the device's ESD ratings and ensure that the circuit design meets or exceeds these ratings to prevent ESD-related damage.