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Part Details for BSP75NHUMA1 by Infineon Technologies AG
Results Overview of BSP75NHUMA1 by Infineon Technologies AG
- Distributor Offerings: (17 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Space Technology
Environmental Monitoring
Internet of Things (IoT)
Smart Cities
Energy and Power Systems
Transportation and Logistics
Agriculture Technology
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Medical Imaging
Automotive
Consumer Electronics
Security and Surveillance
Aerospace and Defense
Healthcare
Renewable Energy
Robotics and Drones
BSP75NHUMA1 Information
BSP75NHUMA1 by Infineon Technologies AG is a Peripheral Driver.
Peripheral Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for BSP75NHUMA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
47W3340
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Newark | Power Load Sw, Low Side, -40 To 150Deg C, Power Load Switch Type:Low Side, No. Of Channels:1Channels, Input Voltage:20V, Current Limit:1A, On State Resistance:0.55Ohm, Ic Case/Package:Sot-223, No. Of Pins:4Pins, Product Range:- Rohs Compliant: Yes |Infineon BSP75NHUMA1 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Bulk | 7324 |
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$1.5800 | Buy Now |
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DISTI #
BSP75NHUMA1CT-ND
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DigiKey | IC PWR SWTCH N-CHAN 1:1 SOT223-4 Min Qty: 1 Lead time: 8 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) | Limited Supply - Call |
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$0.7228 / $1.5300 | Buy Now |
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DISTI #
BSP75NHUMA1
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Avnet Americas | Smart Power Switch, Low Side, 1 Output, 1A, SOT-223-4 - Tape and Reel (Alt: BSP75NHUMA1) RoHS: Compliant Min Qty: 4000 Package Multiple: 4000 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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$0.6771 / $0.7069 | Buy Now |
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DISTI #
82119166
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Verical | Current Limit SW 1-IN 1-OUT -0.2V to 10V 1.9A Automotive AEC-Q100 4-Pin(3+Tab) SOT-223 T/R RoHS: Compliant Min Qty: 38 Package Multiple: 1 Date Code: 2424 | Americas - 3839 |
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$0.7980 / $1.5200 | Buy Now |
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DISTI #
84462334
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Verical | Current Limit SW 1-IN 1-OUT -0.2V to 10V 1.9A Automotive AEC-Q100 4-Pin(3+Tab) SOT-223 T/R RoHS: Compliant Min Qty: 10 Package Multiple: 1 | Americas - 220 |
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$1.1110 | Buy Now |
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Bristol Electronics | 3 |
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RFQ | ||
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Rochester Electronics | N channel vertical power FET in Smart SIPMOS technology RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 249 |
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$0.5702 / $0.9197 | Buy Now |
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DISTI #
BSP75NHUMA1
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IBS Electronics | BSP75 60V 0.5 OHM SELF-PROTECTED LOW-SIDE INTELLIFETTM MOSFET SWITCH- SOT-223 Min Qty: 4000 Package Multiple: 1 | 0 |
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$0.9035 | Buy Now |
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DISTI #
BSP75NHUMA1
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Chip One Stop | Semiconductors RoHS: Compliant pbFree: Yes Min Qty: 1 Lead time: 0 Weeks, 1 Days Container: Cut Tape | 3839 |
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$0.6610 / $1.5200 | Buy Now |
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Chip-Germany GmbH | RoHS: Not Compliant | 16 |
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RFQ |
Part Details for BSP75NHUMA1
BSP75NHUMA1 CAD Models
BSP75NHUMA1 Part Data Attributes
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BSP75NHUMA1
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
BSP75NHUMA1
Infineon Technologies AG
Buffer/Inverter Based Peripheral Driver, 0.7A, PDSO4, GREEN, PLASTIC, SOT-223, 4 PIN
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | SOT-223 | |
| Package Description | SOT-223, 4 PIN | |
| Pin Count | 4 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Built-in Protections | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL | |
| Driver Number of Bits | 1 | |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
| JESD-30 Code | R-PDSO-G4 | |
| JESD-609 Code | e3 | |
| Length | 6.5 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 4 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current Flow Direction | SINK | |
| Output Peak Current Limit-Nom | 1.5 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOT-223 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.8 mm | |
| Supply Current-Max | 2 mA | |
| Supply Voltage-Nom | 5 V | |
| Supply Voltage1-Max | 75 V | |
| Supply Voltage1-Min | 60 V | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 2.3 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Turn-off Time | 20 µs | |
| Turn-on Time | 20 µs | |
| Width | 3.5 mm |
BSP75NHUMA1 Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a thermal via array underneath the device is recommended. The thermal vias should be connected to a solid copper plane on the bottom layer to dissipate heat efficiently.
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The device requires a stable voltage supply and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to provide a stable voltage and current to the device.
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For high-frequency operation, it's essential to minimize parasitic inductance and capacitance. Use a ground plane, keep signal traces short and wide, and avoid vias and right-angle bends in the signal path.
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Use ESD protection devices such as TVS diodes or ESD arrays at the input and output pins. Ensure that the PCB design includes a clear path to ground for ESD discharge.
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For high-power applications, ensure good thermal contact between the device and a heat sink. Use a thermal interface material (TIM) and a heat sink with a high thermal conductivity. Ensure good airflow around the heat sink.