Part Details for BSP19,115 by NXP Semiconductors
Results Overview of BSP19,115 by NXP Semiconductors
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (9 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BSP19,115 Information
BSP19,115 by NXP Semiconductors is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BSP19,115
Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 7852 |
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RFQ |
Part Details for BSP19,115
BSP19,115 CAD Models
BSP19,115 Part Data Attributes
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BSP19,115
NXP Semiconductors
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Datasheet
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BSP19,115
NXP Semiconductors
BSP19_20 - NPN high-voltage transistors SC-73 4-Pin
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Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SC-73 | |
Package Description | PLASTC, SMD, SC-73, 4 PIN | |
Pin Count | 4 | |
Manufacturer Package Code | SOT223 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.29.00.75 | |
Case Connection | COLLECTOR | |
Collector Current-Max (IC) | 1 A | |
Collector-Base Capacitance-Max | 2.5 pF | |
Collector-Emitter Voltage-Max | 350 V | |
Configuration | SINGLE | |
DC Current Gain-Min (hFE) | 40 | |
JESD-30 Code | R-PDSO-G4 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 4 | |
Operating Temperature-Max | 150 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity/Channel Type | NPN | |
Power Dissipation-Max (Abs) | 1.5 W | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Finish | TIN | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON | |
Transition Frequency-Nom (fT) | 70 MHz | |
VCEsat-Max | 0.5 V |
Alternate Parts for BSP19,115
This table gives cross-reference parts and alternative options found for BSP19,115. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BSP19,115, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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BSP19-T | NXP Semiconductors | Check for Price | TRANSISTOR 1 A, 350 V, NPN, Si, POWER TRANSISTOR, BIP General Purpose Power | BSP19,115 vs BSP19-T |
BSP19T/R | Nexperia | Check for Price | Power Bipolar Transistor | BSP19,115 vs BSP19T/R |
BSP19 | Zetex / Diodes Inc | Check for Price | Power Bipolar Transistor, 0.5A I(C), 350V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin, SOT-223, 4 PIN | BSP19,115 vs BSP19 |
BSP19-TAPE-13 | NXP Semiconductors | Check for Price | TRANSISTOR 1 A, 350 V, NPN, Si, POWER TRANSISTOR, BIP General Purpose Power | BSP19,115 vs BSP19-TAPE-13 |
BSP19-T | Nexperia | Check for Price | Power Bipolar Transistor | BSP19,115 vs BSP19-T |
BSP19-TAPE-7 | NXP Semiconductors | Check for Price | TRANSISTOR 1 A, 350 V, NPN, Si, POWER TRANSISTOR, BIP General Purpose Power | BSP19,115 vs BSP19-TAPE-7 |
BSP19TC | Zetex / Diodes Inc | Check for Price | Power Bipolar Transistor, 0.5A I(C), 350V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin | BSP19,115 vs BSP19TC |
BSP19TA | Diodes Incorporated | Check for Price | Power Bipolar Transistor, 0.5A I(C), 350V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin | BSP19,115 vs BSP19TA |
BSP19TC | Diodes Incorporated | Check for Price | Power Bipolar Transistor, 0.5A I(C), 350V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin | BSP19,115 vs BSP19TC |
BSP19,115 Frequently Asked Questions (FAQ)
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A good PCB layout for the BSP19,115 involves keeping the input and output tracks separate, using a solid ground plane, and minimizing track lengths and widths to reduce parasitic inductance and capacitance. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
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To ensure proper biasing, it's essential to follow the recommended biasing scheme in the datasheet. Typically, this involves connecting the base to a voltage divider network, and the emitter to a current-limiting resistor. The collector should be connected to a load or a pull-up resistor, depending on the application.
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The BSP19,115 has a maximum junction temperature of 150°C. To prevent overheating, ensure good heat dissipation by using a heat sink, keeping the device away from other heat sources, and minimizing power dissipation. Also, follow the recommended derating curves for power dissipation versus ambient temperature.
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Yes, the BSP19,115 can be used in switching applications. However, it's essential to consider the device's switching characteristics, such as the transition frequency, rise and fall times, and the maximum collector current. Additionally, ensure that the device is properly biased and that the load is properly decoupled to prevent ringing and oscillations.
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To protect the BSP19,115 from ESD, handle the device by the body or use an anti-static wrist strap. Ensure that the PCB and assembly process follow ESD-safe practices. Additionally, consider adding ESD protection devices, such as TVS diodes or ESD protection arrays, to the PCB design.