Part Details for BSO613SPVG by Infineon Technologies AG
Results Overview of BSO613SPVG by Infineon Technologies AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BSO613SPVG Information
BSO613SPVG by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for BSO613SPVG
BSO613SPVG CAD Models
BSO613SPVG Part Data Attributes
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BSO613SPVG
Infineon Technologies AG
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Datasheet
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BSO613SPVG
Infineon Technologies AG
Power Field-Effect Transistor, 3.44A I(D), 60V, 0.13ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, SOP-8
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | SOT | |
| Package Description | SMALL OUTLINE, R-PDSO-G8 | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Additional Feature | AVALANCHE RATED | |
| Avalanche Energy Rating (Eas) | 150 mJ | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 60 V | |
| Drain Current-Max (ID) | 3.44 A | |
| Drain-source On Resistance-Max | 0.13 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 3 | |
| Number of Elements | 1 | |
| Number of Terminals | 8 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | P-CHANNEL | |
| Power Dissipation-Max (Abs) | 2.5 W | |
| Pulsed Drain Current-Max (IDM) | 13.8 A | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Element Material | SILICON |
Alternate Parts for BSO613SPVG
This table gives cross-reference parts and alternative options found for BSO613SPVG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BSO613SPVG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| BSO613SPVGHUMA1 | Infineon Technologies AG | Check for Price | Power Field-Effect Transistor, 3.44A I(D), 60V, 0.13ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, SOP-8 | BSO613SPVG vs BSO613SPVGHUMA1 |
BSO613SPVG Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in the application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
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To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable thermal interface material, and consider using a heat sink or thermal management system. Additionally, ensure that the device is properly soldered and that the PCB is designed to withstand the expected temperatures.
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Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially even device failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
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To troubleshoot issues related to the device's built-in thermal protection, check the device's datasheet for specific guidance on thermal protection thresholds and behavior. Use a thermal camera or temperature measurement tools to monitor the device's temperature, and verify that the thermal protection is not triggered unnecessarily.
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Infineon recommends following the soldering conditions outlined in the datasheet, which include a peak temperature of 260°C, a soldering time of 10 seconds, and a soldering method that ensures a reliable and void-free connection.