Part Details for BSM15GP120BPSA1 by Infineon Technologies AG
Results Overview of BSM15GP120BPSA1 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BSM15GP120BPSA1 Information
BSM15GP120BPSA1 by Infineon Technologies AG is an IGBT.
IGBTs are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BSM15GP120BPSA1
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BSM15GP120BPSA1
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Avnet Americas | Transistor IGBT Module N-CH 1200V 35A 20V Screw Mount Tray - Trays (Alt: BSM15GP120BPSA1) RoHS: Not Compliant Min Qty: 15 Package Multiple: 15 Lead time: 111 Weeks, 0 Days Container: Tray | 0 |
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Part Details for BSM15GP120BPSA1
BSM15GP120BPSA1 CAD Models
BSM15GP120BPSA1 Part Data Attributes
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BSM15GP120BPSA1
Infineon Technologies AG
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Datasheet
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BSM15GP120BPSA1
Infineon Technologies AG
Insulated Gate Bipolar Transistor,
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | Infineon |
BSM15GP120BPSA1 Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and heat sink design to ensure optimal thermal performance.
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Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the IGBT's gate-emitter voltage. The driver should also have a suitable propagation delay and rise/fall time to ensure proper switching.
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The maximum allowed overcurrent is typically 2-3 times the rated current. To protect the module, use a fast-acting fuse or a current sensor with a shutdown circuit to detect overcurrent conditions and disconnect the power supply.
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Infineon provides thermal impedance data in the datasheet. Use this data to design a heat sink with a thermal resistance that meets the required junction temperature. Ensure good thermal contact between the module and heat sink using thermal interface materials and screws.
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Infineon provides guidelines for soldering and assembly in their application note AN2013-04. Follow the recommended soldering temperature, time, and flux type to ensure reliable connections and avoid damage to the module.