Part Details for BSM100GD120DLCBOSA1 by Infineon Technologies AG
Results Overview of BSM100GD120DLCBOSA1 by Infineon Technologies AG
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BSM100GD120DLCBOSA1 Information
BSM100GD120DLCBOSA1 by Infineon Technologies AG is an IGBT.
IGBTs are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BSM100GD120DLCBOSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-BSM100GD120DLCBOSA1-448-ND
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DigiKey | LOW POWER ECONO Min Qty: 1 Lead time: 1 Weeks Container: Bulk MARKETPLACE PRODUCT |
4 In Stock |
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$353.0600 | Buy Now |
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DISTI #
BSM100GD120DLCBOSA1
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Avnet Americas | Transistor IGBT Module N-CH 1200V 160A 20V Screw Mount Tray - Trays (Alt: BSM100GD120DLCBOSA1) RoHS: Not Compliant Min Qty: 10 Package Multiple: 10 Lead time: 111 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
85972884
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Verical | Trans IGBT Module N-CH 1200V 160A 650W 19-Pin ECONO3 Min Qty: 1 Package Multiple: 1 Date Code: 2201 | Americas - 30 |
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$424.3500 | Buy Now |
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Rochester Electronics | LOW POWER ECONO RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 | 64 |
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$298.7400 / $339.4800 | Buy Now |
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DISTI #
SP000100385
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EBV Elektronik | Trans IGBT Module NCH 12kV 100A nom 650W 21Pin EconoPACK 3A 1215x615mm (Alt: SP000100385) RoHS: Compliant Min Qty: 10 Package Multiple: 10 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now |
Part Details for BSM100GD120DLCBOSA1
BSM100GD120DLCBOSA1 CAD Models
BSM100GD120DLCBOSA1 Part Data Attributes
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BSM100GD120DLCBOSA1
Infineon Technologies AG
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Datasheet
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BSM100GD120DLCBOSA1
Infineon Technologies AG
Insulated Gate Bipolar Transistor, 160A I(C), 1200V V(BR)CES, N-Channel, ECONO 3, 39 PIN
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| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | ECONO 3, 39 PIN | |
| Pin Count | 39 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 111 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Case Connection | ISOLATED | |
| Collector Current-Max (IC) | 160 A | |
| Collector-Emitter Voltage-Max | 1200 V | |
| Configuration | BRIDGE, 6 ELEMENTS WITH BUILT-IN DIODE | |
| JESD-30 Code | R-XUFM-X39 | |
| Number of Elements | 6 | |
| Number of Terminals | 39 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | N-CHANNEL | |
| Qualification Status | Not Qualified | |
| Surface Mount | NO | |
| Terminal Form | UNSPECIFIED | |
| Terminal Position | UPPER | |
| Transistor Element Material | SILICON | |
| Turn-off Time-Nom (toff) | 480 ns | |
| Turn-on Time-Nom (ton) | 110 ns |
BSM100GD120DLCBOSA1 Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in their application note AN2019-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
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Infineon recommends using a gate driver with a minimum output current of 2A and a maximum output voltage of 20V to ensure reliable operation. The driver should also be able to handle the module's input capacitance of 10nF.
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The maximum allowed overcurrent is 2x the nominal current (120A) for a maximum of 10ms, and the maximum allowed overvoltage is 1.5x the nominal voltage (1200V) for a maximum of 10ms. Exceeding these limits can damage the module.
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Infineon recommends following the guidelines in their application note AN2019-02, which includes recommendations for PCB layout, shielding, and filtering to ensure EMC compliance.
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Infineon recommends using a heat sink with a thermal resistance of ≤0.5K/W and a forced air cooling system with a minimum airflow of 200LFM to ensure reliable operation.