Part Details for BSL308PEL6327HTSA1 by Infineon Technologies AG
Results Overview of BSL308PEL6327HTSA1 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BSL308PEL6327HTSA1 Information
BSL308PEL6327HTSA1 by Infineon Technologies AG is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BSL308PEL6327HTSA1
Part # | Distributor | Description | Stock | Price | Buy | |
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Vyrian | Transistors | 554 |
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RFQ |
Part Details for BSL308PEL6327HTSA1
BSL308PEL6327HTSA1 CAD Models
BSL308PEL6327HTSA1 Part Data Attributes
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BSL308PEL6327HTSA1
Infineon Technologies AG
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Datasheet
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BSL308PEL6327HTSA1
Infineon Technologies AG
Small Signal Field-Effect Transistor, 2.1A I(D), 30V, 2-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, TSOP-6
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Part Package Code | TSOP | |
Package Description | GREEN, PLASTIC, TSOP-6 | |
Pin Count | 6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
Additional Feature | LOGIC LEVEL COMPATIBLE | |
Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | |
DS Breakdown Voltage-Min | 30 V | |
Drain Current-Max (ID) | 2.1 A | |
Drain-source On Resistance-Max | 0.08 Ω | |
FET Technology | METAL-OXIDE SEMICONDUCTOR | |
Feedback Cap-Max (Crss) | 7.8 pF | |
JESD-30 Code | R-PDSO-G6 | |
Number of Elements | 2 | |
Number of Terminals | 6 | |
Operating Mode | ENHANCEMENT MODE | |
Operating Temperature-Max | 150 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Polarity/Channel Type | P-CHANNEL | |
Qualification Status | Not Qualified | |
Surface Mount | YES | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Transistor Element Material | SILICON |
BSL308PEL6327HTSA1 Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
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Infineon provides EMC guidelines in their application note AN2013-02, which includes recommendations for PCB layout, shielding, and filtering to minimize electromagnetic interference.
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According to Infineon's application note AN2013-03, the maximum allowed voltage transient on the input pins is 100 ns, with a maximum amplitude of 2x the nominal voltage.
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Infineon recommends using an external current sense resistor and a comparator to detect overcurrent conditions. The application note AN2013-04 provides a detailed design example.
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Infineon provides a recommended soldering profile in their package datasheet, which includes temperature and time guidelines for reflow soldering.