Part Details for BSL308CL6327HTSA1 by Infineon Technologies AG
Results Overview of BSL308CL6327HTSA1 by Infineon Technologies AG
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Energy and Power Systems
Renewable Energy
Automotive
BSL308CL6327HTSA1 Information
BSL308CL6327HTSA1 by Infineon Technologies AG is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BSL308CL6327HTSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | MOSFET N/P-CH 30V 2.3A/2A 6TSOP | 88012 |
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$0.4354 / $0.6537 | Buy Now |
Part Details for BSL308CL6327HTSA1
BSL308CL6327HTSA1 CAD Models
BSL308CL6327HTSA1 Part Data Attributes
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BSL308CL6327HTSA1
Infineon Technologies AG
Buy Now
Datasheet
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BSL308CL6327HTSA1
Infineon Technologies AG
Small Signal Field-Effect Transistor, 2.3A I(D), 30V, 2-Element, N-Channel and P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, TSOP-6
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | GREEN, PLASTIC, TSOP-6 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Additional Feature | AVALANCHE RATED | |
| Configuration | SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 30 V | |
| Drain Current-Max (ID) | 2.3 A | |
| Drain-source On Resistance-Max | 0.057 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| Feedback Cap-Max (Crss) | 17 pF | |
| JESD-30 Code | R-PDSO-G6 | |
| Number of Elements | 2 | |
| Number of Terminals | 6 | |
| Operating Mode | ENHANCEMENT MODE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Polarity/Channel Type | N-CHANNEL AND P-CHANNEL | |
| Reference Standard | AEC-Q101 | |
| Surface Mount | YES | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Element Material | SILICON |
BSL308CL6327HTSA1 Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in the application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.
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Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the IGBT's gate-emitter voltage. The driver should also have a suitable propagation delay and rise/fall time to ensure proper switching.
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The BSL308CL6327HTSA1 has an internal overcurrent protection (OCP) feature that trips at 20A. However, it's recommended to implement an external OCP circuit to ensure reliable protection. The datasheet provides guidelines for designing an external OCP circuit.
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Proper cooling can be achieved by using a heat sink with a thermal resistance of ≤ 0.5 K/W, ensuring good thermal contact between the module and heat sink, and providing adequate airflow. The datasheet provides thermal resistance and power dissipation data to aid in heat sink selection.
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Infineon provides guidelines for soldering and assembly in the application note AN2013-04, which covers topics such as soldering temperature, time, and flux selection, as well as handling and storage precautions.