Part Details for BSL307SPH6327XTSA1 by Infineon Technologies AG
Results Overview of BSL307SPH6327XTSA1 by Infineon Technologies AG
- Distributor Offerings: (14 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BSL307SPH6327XTSA1 Information
BSL307SPH6327XTSA1 by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BSL307SPH6327XTSA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
97Y1256
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Newark | Mosfet, P-Ch, -30V, -5.5A, Tsop-6, Transistor Polarity:P Channel, Continuous Drain Current Id:-5.5A, Drain Source Voltage Vds:-30V, On Resistance Rds(On):0.031Ohm, Rds(On) Test Voltage Vgs:-10V, Threshold Voltage Vgs:-1.5V, Power Rohs Compliant: Yes |Infineon BSL307SPH6327XTSA1 RoHS: Compliant Min Qty: 1 Package Multiple: 1 Date Code: 1 Container: Cut Tape | 3149 |
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$0.2830 / $0.6600 | Buy Now |
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DISTI #
BSL307SPH6327XTSA1CT-ND
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DigiKey | MOSFET P-CH 30V 5.5A 6TSOP Min Qty: 1 Lead time: 10 Weeks Container: Digi-Reel®, Cut Tape (CT), Tape & Reel (TR) |
8295 In Stock |
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$0.1995 / $0.7600 | Buy Now |
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DISTI #
BSL307SPH6327XTSA1
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Avnet Americas | Trans MOSFET P-CH 30V 5.5A 6-Pin TSOP T/R - Tape and Reel (Alt: BSL307SPH6327XTSA1) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 10 Weeks, 0 Days Container: Reel | 0 |
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$0.1565 / $0.1597 | Buy Now |
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DISTI #
726-BSL307SPH6327XTS
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Mouser Electronics | MOSFETs SMALL SIGNAL+P-CH RoHS: Compliant | 5230 |
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$0.2000 / $0.7200 | Buy Now |
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DISTI #
V36:1790_06391999
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Arrow Electronics | Trans MOSFET P-CH 30V 5.5A Automotive AEC-Q101 6-Pin TSOP T/R RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 10 Weeks Date Code: 2340 | Americas - 9000 |
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$0.1693 / $0.1738 | Buy Now |
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DISTI #
78821077
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Verical | Trans MOSFET P-CH 30V 5.5A Automotive AEC-Q101 6-Pin TSOP T/R RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Date Code: 2340 | Americas - 9000 |
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$0.1693 / $0.1738 | Buy Now |
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DISTI #
82118996
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Verical | Trans MOSFET P-CH 30V 5.5A Automotive AEC-Q101 6-Pin TSOP T/R RoHS: Compliant Min Qty: 115 Package Multiple: 1 Date Code: 2420 | Americas - 3000 |
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$0.2360 / $0.3630 | Buy Now |
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Rochester Electronics | Small Signal MosFETs RoHS: Compliant Status: Active Min Qty: 1 | 1847 |
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$0.1621 / $0.2615 | Buy Now |
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DISTI #
BSL307SPH6327XTSA1
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TME | Transistor: P-MOSFET, unipolar, -30V, -5.5A, 2W, PG-TSOP-6 Min Qty: 1 | 0 |
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$0.1950 / $0.7030 | RFQ |
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ComSIT USA | AVAILABLE EU | 4416 |
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RFQ |
Part Details for BSL307SPH6327XTSA1
BSL307SPH6327XTSA1 CAD Models
BSL307SPH6327XTSA1 Part Data Attributes
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BSL307SPH6327XTSA1
Infineon Technologies AG
Buy Now
Datasheet
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BSL307SPH6327XTSA1
Infineon Technologies AG
Power Field-Effect Transistor, 5.5A I(D), 30V, 0.043ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, TSOP-6-1, 6 PIN
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | GREEN, PLASTIC, TSOP-6-1, 6 PIN | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 10 Weeks | |
| Samacsys Manufacturer | Infineon | |
| Additional Feature | AVALANCHE RATED | |
| Avalanche Energy Rating (Eas) | 44 mJ | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 30 V | |
| Drain Current-Max (ID) | 5.5 A | |
| Drain-source On Resistance-Max | 0.043 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PDSO-G6 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 6 | |
| Operating Mode | ENHANCEMENT MODE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | P-CHANNEL | |
| Pulsed Drain Current-Max (IDM) | 22 A | |
| Reference Standard | AEC-Q101 | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
BSL307SPH6327XTSA1 Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal pad design, copper thickness, and via placement to ensure optimal thermal performance.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable thermal interface material, and implement a robust cooling system. Additionally, consider using a thermistor or thermocouple to monitor the device temperature.
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Exceeding the maximum junction temperature (Tj) rating can lead to reduced lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
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To prevent electrostatic discharge (ESD) damage, follow proper handling and assembly procedures, such as using ESD-safe materials, grounding straps, and ionizers. Ensure that all personnel handling the device are properly grounded, and use ESD-protected workstations and tools.
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Infineon provides recommended soldering profiles in their application note AN2013-01, which includes guidelines for reflow soldering, wave soldering, and hand soldering. It's essential to follow these profiles to prevent damage to the device during the soldering process.