Datasheets
BSL306NH6327XTSA1 by: Infineon Technologies AG

Small Signal Field-Effect Transistor,

Part Details for BSL306NH6327XTSA1 by Infineon Technologies AG

Results Overview of BSL306NH6327XTSA1 by Infineon Technologies AG

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BSL306NH6327XTSA1 Information

BSL306NH6327XTSA1 by Infineon Technologies AG is a Small Signal Field-Effect Transistor.
Small Signal Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for BSL306NH6327XTSA1

Part # Distributor Description Stock Price Buy
DISTI # SP001100664
EBV Elektronik Transistor MOSFET Array Dual NCH 30V 23A 6Pin TSOP TR (Alt: SP001100664) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days EBV - 0
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Vyrian Transistors 511
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Part Details for BSL306NH6327XTSA1

BSL306NH6327XTSA1 CAD Models

BSL306NH6327XTSA1 Part Data Attributes

BSL306NH6327XTSA1 Infineon Technologies AG
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BSL306NH6327XTSA1 Infineon Technologies AG Small Signal Field-Effect Transistor,
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description TSOP-6
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.21.00.95
Samacsys Manufacturer Infineon
Configuration SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 30 V
Drain Current-Max (ID) 2.3 A
Drain-source On Resistance-Max 0.057 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 17 pF
JESD-30 Code R-PDSO-G6
JESD-609 Code e3
Moisture Sensitivity Level 1
Number of Elements 2
Number of Terminals 6
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Polarity/Channel Type N-CHANNEL
Power Dissipation Ambient-Max 0.5 W
Power Dissipation-Max (Abs) 0.5 W
Reference Standard AEC-Q101
Surface Mount YES
Terminal Finish TIN
Terminal Form GULL WING
Terminal Position DUAL
Transistor Element Material SILICON

BSL306NH6327XTSA1 Related Parts

BSL306NH6327XTSA1 Frequently Asked Questions (FAQ)

  • For optimal performance, it's recommended to follow Infineon's guidelines for PCB layout and thermal management. This includes using a multi-layer PCB with a solid ground plane, placing thermal vias under the device, and using a heat sink with a thermal interface material. Additionally, ensure good airflow around the device and avoid thermal hotspots.

  • To ensure EMC and reduce EMI, follow Infineon's guidelines for PCB layout, component placement, and shielding. Use a shielded enclosure, and consider using EMI filters or common-mode chokes. Also, ensure proper grounding and decoupling of the device.

  • The reliability and lifespan of the BSL306NH6327XTSA1 depend on various factors, including operating temperature, voltage, and current. According to Infineon's reliability data, the device is designed to meet the requirements of the automotive industry, with a typical lifespan of 15 years or more under normal operating conditions.

  • To troubleshoot and debug issues, use a systematic approach, starting with a review of the datasheet and application notes. Verify the device's operating conditions, including voltage, current, and temperature. Use oscilloscopes and logic analyzers to monitor signals and identify potential issues. Consult Infineon's support resources and application notes for guidance on specific troubleshooting techniques.

  • When using the BSL306NH6327XTSA1 in a safety-critical application, ensure compliance with relevant safety standards, such as ISO 26262 or IEC 61508. Follow Infineon's guidelines for safety-critical applications, and consider using safety mechanisms, such as redundancy, error detection, and correction. Consult with safety experts and conduct thorough risk assessments to ensure the device is used in a way that meets safety requirements.

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