Part Details for BSC120N03MSG by Infineon Technologies AG
Results Overview of BSC120N03MSG by Infineon Technologies AG
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BSC120N03MSG Information
BSC120N03MSG by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BSC120N03MSG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 10 |
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RFQ | ||
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Quest Components | POWER FIELD-EFFECT TRANSISTOR, 11A I(D), 30V, 0.012OHM, 1-ELEMENT, N-CHANNEL, SILICON, METAL-OXIDE SEMICONDUCTOR FET | 1132 |
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$0.3150 / $0.7875 | Buy Now |
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DISTI #
SMC-BSC120N03MSG
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Sensible Micro Corporation | OEM Excess 5-7 Days Leadtime, We are an AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 3673 |
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RFQ | |
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Component Electronics, Inc | IN STOCK SHIP TODAY | 90 |
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$2.5000 / $3.8500 | Buy Now |
Part Details for BSC120N03MSG
BSC120N03MSG CAD Models
BSC120N03MSG Part Data Attributes
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BSC120N03MSG
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
BSC120N03MSG
Infineon Technologies AG
Power Field-Effect Transistor, 11A I(D), 30V, 0.012ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, TDSON-8
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Package Description | GREEN, PLASTIC, TDSON-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| Additional Feature | AVALANCHE RATED | |
| Avalanche Energy Rating (Eas) | 10 mJ | |
| Case Connection | DRAIN | |
| Configuration | SINGLE WITH BUILT-IN DIODE | |
| DS Breakdown Voltage-Min | 30 V | |
| Drain Current-Max (ID) | 11 A | |
| Drain-source On Resistance-Max | 0.012 Ω | |
| FET Technology | METAL-OXIDE SEMICONDUCTOR | |
| JESD-30 Code | R-PDSO-F8 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 8 | |
| Operating Mode | ENHANCEMENT MODE | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | N-CHANNEL | |
| Power Dissipation-Max (Abs) | 28 W | |
| Pulsed Drain Current-Max (IDM) | 156 A | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | FLAT | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON |
Alternate Parts for BSC120N03MSG
This table gives cross-reference parts and alternative options found for BSC120N03MSG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BSC120N03MSG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| BSC120N03MSGATMA1 | Infineon Technologies AG | $0.3782 | Power Field-Effect Transistor, 11A I(D), 30V, 0.012ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, GREEN, PLASTIC, TDSON-8 | BSC120N03MSG vs BSC120N03MSGATMA1 |
BSC120N03MSG Frequently Asked Questions (FAQ)
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The maximum safe operating area (SOA) for the BSC120N03MSG is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal and electrical characteristics. As a general guideline, the SOA is typically limited by the device's maximum junction temperature, voltage, and current ratings. It's recommended to consult with Infineon's application notes or contact their technical support for more information.
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To ensure proper cooling, it's essential to provide a good thermal interface between the device and the heat sink or PCB. Apply a thin layer of thermal interface material (TIM) to the device's drain pad, and ensure the heat sink is properly mounted and secured. The datasheet provides thermal resistance values (RthJA and RthJC) that can be used to estimate the device's junction temperature. Additionally, consider using a heat sink with a high thermal conductivity and a sufficient surface area to dissipate heat effectively.
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The recommended gate drive voltage for the BSC120N03MSG is typically between 10V to 15V, with a current capability of up to 1A to 2A, depending on the specific application requirements. However, it's essential to consult the datasheet and application notes for more detailed information on gate drive requirements, as excessive gate voltage or current can damage the device.
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To protect the BSC120N03MSG from electrostatic discharge (ESD), it's essential to handle the device with care during assembly and storage. Use ESD-safe materials, such as wrist straps, mats, and bags, and ensure that all equipment and tools are properly grounded. Additionally, consider implementing ESD protection circuits or devices in the application circuit to prevent ESD events from damaging the device.
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For optimal performance and reliability, it's essential to follow good PCB layout and design practices when using the BSC120N03MSG. Keep the power traces short and wide, use a solid ground plane, and ensure proper decoupling and bypassing. Additionally, consider the device's thermal pad and ensure it's properly connected to the heat sink or PCB. Consult the datasheet and application notes for more detailed information on PCB design considerations.