-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Programmable RFSoC, CMOS
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BM83SM1-00TB by Microchip Technology Inc is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
73AJ1950
|
Newark | Bluetooth Audio Class 1 Transceiver Module With A2Dp Source 50 Module 32X15X2.5Mm Tray Rohs Compliant: Yes |Microchip BM83SM1-00TB RoHS: Compliant Min Qty: 56 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$10.5200 / $11.0700 | Buy Now |
DISTI #
150-BM83SM1-00TB-ND
|
DigiKey | RF TXRX MOD BT PCB TH SMD Min Qty: 1 Lead time: 8 Weeks Container: Tray |
70 In Stock |
|
$11.1752 / $12.2000 | Buy Now |
DISTI #
BM83SM1-00TB
|
Avnet Americas | Bluetooth SoC, Bluetooth 5.0, Module - Trays (Alt: BM83SM1-00TB) RoHS: Not Compliant Min Qty: 56 Package Multiple: 56 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
|
$10.4598 / $11.1750 | Buy Now |
DISTI #
579-BM83SM1-00TB
|
Mouser Electronics | Bluetooth Modules - 802.15.1 Bluetooth Audio Class 1 Transceiver Module with A2DP Source | 331 |
|
$11.1700 / $12.2000 | Buy Now |
DISTI #
BM83SM1-00TB
|
Microchip Technology Inc | Class-1 50LD BLUETOOTH AUDIO MODULE WITH SHIED. 32*15mm, MODULE, Projected EOL: 2049-10-12 COO: Taiwan, Thailand ECCN: 5A992.c RoHS: Compliant Lead time: 8 Weeks, 0 Days Container: Tray |
0 Alternates Available |
|
$8.8100 / $12.2000 | Buy Now |
|
Onlinecomponents.com | BM83 Bluetooth Stereo Audio Module - Bluetooth v5.0 - GFSK Modulation - 2.4GHz - 3Mbps - 11dBm Power - 3.2 to 4.2V - 50-SMD Module. RoHS: Compliant | 0 |
|
$10.8700 / $13.3400 | Buy Now |
|
Bristol Electronics | 211 |
|
RFQ | ||
|
NAC | Bluetooth Audio Class 1 Transceiver Module with A2DP Source, 50 MODULE 32x15x2.5mm TRAY RoHS: Compliant Min Qty: 56 Package Multiple: 56 | 0 |
|
$10.9000 / $13.1500 | Buy Now |
DISTI #
BM83SM1-00TB
|
Avnet Silica | Bluetooth SoC Bluetooth 50 Module (Alt: BM83SM1-00TB) RoHS: Compliant Min Qty: 56 Package Multiple: 56 Lead time: 10 Weeks, 0 Days | Silica - 0 |
|
Buy Now | |
DISTI #
BM83SM1-00TB
|
EBV Elektronik | Bluetooth SoC Bluetooth 50 Module (Alt: BM83SM1-00TB) RoHS: Compliant Min Qty: 56 Package Multiple: 56 Lead time: 9 Weeks, 0 Days | EBV - 0 |
|
Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
BM83SM1-00TB
Microchip Technology Inc
Buy Now
Datasheet
|
Compare Parts:
BM83SM1-00TB
Microchip Technology Inc
Programmable RFSoC, CMOS
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Package Description | PACKAGE-50 | |
Reach Compliance Code | unknown | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Microchip | |
JESD-30 Code | R-XXMA-N50 | |
Length | 32 mm | |
Number of Terminals | 50 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | UNSPECIFIED | |
Package Code | XMA | |
Package Shape | RECTANGULAR | |
Package Style | MICROELECTRONIC ASSEMBLY | |
Seated Height-Max | 2.5 mm | |
Supply Voltage-Max | 4.2 V | |
Supply Voltage-Min | 3.2 V | |
Supply Voltage-Nom | 3.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | NO LEAD | |
Terminal Pitch | 1 mm | |
Terminal Position | UNSPECIFIED | |
Width | 15 mm | |
uPs/uCs/Peripheral ICs Type | Bluetooth SoC |
Microchip provides a recommended PCB layout in the BM83SM1-00TB evaluation board user's guide. It's essential to follow the layout guidelines to minimize noise, ensure proper thermal management, and optimize performance.
To minimize power consumption, configure the device to use the lowest possible clock frequency, disable unnecessary peripherals, and use the power-saving modes (e.g., sleep, idle) when possible. Refer to the datasheet for specific register settings and power-saving techniques.
The BM83SM1-00TB has a thermal pad on the bottom of the package. Ensure good thermal conductivity by using a thermal interface material (e.g., thermal tape, thermal grease) and a heat sink if necessary. Keep the device away from heat sources and ensure good airflow around the PCB.
To troubleshoot crystal oscillator issues, check the crystal resonator's specifications, ensure proper PCB layout and routing, and verify the oscillator configuration registers. Use an oscilloscope to measure the clock signal and verify it's within the specified frequency range.
To ensure EMI and EMC compliance, follow proper PCB layout and routing guidelines, use shielding and filtering components as necessary, and ensure the device is properly grounded. Refer to the datasheet and application notes for specific guidance on EMI and EMC considerations.