Datasheets
BM78SPPS5MC2-0001AA by: Microchip Technology Inc

Telecom Circuit, 1-Func

Part Details for BM78SPPS5MC2-0001AA by Microchip Technology Inc

Results Overview of BM78SPPS5MC2-0001AA by Microchip Technology Inc

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities

BM78SPPS5MC2-0001AA Information

BM78SPPS5MC2-0001AA by Microchip Technology Inc is an Other Telecom IC.
Other Telecom ICs are under the broader part category of Telecommunication Circuits.

A telecommunications circuit transmits and receives information between points. Key components include transmitters, receivers, amplifiers, and multiplexers. Read more about Telecommunication Circuits on our Telecommunication Circuits part category page.

Price & Stock for BM78SPPS5MC2-0001AA

Part # Distributor Description Stock Price Buy
DISTI # BM78SPPS5MC2-0001AA
Microchip Technology Inc Bluetooth class 2 Dual Mode surface mount data module with chip antenna, MODULE, Projected EOL: 2039-10-13 COO: Taiwan, Thailand ECCN: 5A992.c RoHS: Compliant Lead time: 12 Weeks, 0 Days Container: Tray 0

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Onlinecomponents.com   RoHS: Compliant Alternative Product Available
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NAC   RoHS: Compliant Min Qty: 1 Package Multiple: 1 0
RFQ
DISTI # BM78SPPS5MC2-0001AA
Avnet Silica Bluetooth Module V 50 LE EDR Class 2 2402GHz to 248GHz 15 dBm IS1678 90dBm 92dBm (Alt: BM78SPPS5MC2-0001AA) RoHS: Compliant Min Qty: 88 Package Multiple: 88 Lead time: 14 Weeks, 0 Days Silica - 0
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Part Details for BM78SPPS5MC2-0001AA

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BM78SPPS5MC2-0001AA Part Data Attributes

BM78SPPS5MC2-0001AA Microchip Technology Inc
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BM78SPPS5MC2-0001AA Microchip Technology Inc Telecom Circuit, 1-Func
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Package Description MODULE-33
Reach Compliance Code compliant
ECCN Code 5A992.C
HTS Code 8529.90.22.00
Factory Lead Time 12 Weeks
Samacsys Manufacturer Microchip
JESD-30 Code X-XXMA-N33
JESD-609 Code e4
Length 22 mm
Number of Functions 1
Number of Terminals 33
Operating Temperature-Max 70 °C
Operating Temperature-Min -20 °C
Package Body Material UNSPECIFIED
Package Code XMA
Package Equivalence Code MODULE,33LEAD(UNSPEC)
Package Shape UNSPECIFIED
Package Style MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Cel) 255
Screening Level TS 16949
Seated Height-Max 2.2 mm
Supply Voltage-Nom 1.9 V
Surface Mount YES
Telecom IC Type TELECOM CIRCUIT
Temperature Grade COMMERCIAL
Terminal Finish GOLD OVER NICKEL
Terminal Form NO LEAD
Terminal Pitch 1.1 mm
Terminal Position UNSPECIFIED
Time@Peak Reflow Temperature-Max (s) 40
Width 12 mm

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