Datasheets
BISMS02BI by: Laird, A DuPont Business

MODULE BISM II BLUETOOTH SMD

Part Details for BISMS02BI by Laird, A DuPont Business

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BISMS02BI Information

BISMS02BI by Laird, A DuPont Business is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for BISMS02BI

Part # Distributor Description Stock Price Buy
DISTI # BISMS02BI-ND
DigiKey RF TXRX MOD BLUETOOTH CHIP SMD Min Qty: 1 Lead time: 52 Weeks Container: Tray 322
In Stock
  • 1 $42.3900
  • 50 $40.0600
  • 100 $37.7301
$37.7301 / $42.3900 Buy Now
DISTI # 239-BISMS02BI
Mouser Electronics Bluetooth Modules - 802.15.1 Class1 Bluetooth Surface Mount Mod RoHS: Compliant 0
Order Now

Part Details for BISMS02BI

BISMS02BI CAD Models

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BISMS02BI Part Data Attributes

BISMS02BI Laird, A DuPont Business
Buy Now Datasheet
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BISMS02BI Laird, A DuPont Business MODULE BISM II BLUETOOTH SMD
Part Life Cycle Code Not Recommended
Ihs Manufacturer EZURIO
Reach Compliance Code unknown
Samacsys Manufacturer Laird Technologies
JESD-30 Code R-XXMA-N
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material UNSPECIFIED
Package Code XMA
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Supply Voltage-Max 7 V
Supply Voltage-Min 3.3 V
Surface Mount NO
Technology CMOS
Terminal Form NO LEAD
Terminal Position UNSPECIFIED
uPs/uCs/Peripheral ICs Type Bluetooth SoC

BISMS02BI Frequently Asked Questions (FAQ)

  • The recommended storage condition for BISMS02BI is in a dry, cool place with a temperature range of -20°C to 40°C and relative humidity below 80%.

  • While BISMS02BI can operate up to 125°C, it's not recommended for continuous use above 100°C. Prolonged exposure to high temperatures can affect its performance and lifespan.

  • Proper thermal management can be achieved by providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.

  • The maximum power rating for BISMS02BI is 2W. Exceeding this rating can cause damage to the device.

  • Yes, BISMS02BI is designed for high-frequency applications up to 6 GHz. However, it's essential to follow proper PCB design and layout guidelines to minimize signal loss and ensure optimal performance.

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