Part Details for BFS17A,235 by NXP Semiconductors
Results Overview of BFS17A,235 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Audio and Video Systems
Telecommunications
Entertainment and Gaming
BFS17A,235 Information
BFS17A,235 by NXP Semiconductors is an Other Transistor.
Other Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BFS17A,235
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BFS17A,235
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Avnet Silica | Trans GP BJT NPN 15V 0025A 3Pin TO236AB TR (Alt: BFS17A,235) RoHS: Compliant Min Qty: 10000 Package Multiple: 10000 | Silica - 0 |
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Buy Now | |
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Vyrian | Transistors | 1214 |
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RFQ |
Part Details for BFS17A,235
BFS17A,235 CAD Models
BFS17A,235 Part Data Attributes
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BFS17A,235
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
BFS17A,235
NXP Semiconductors
BFS17A - NPN 3 GHz wideband transistor TO-236 3-Pin
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | TO-236 | |
| Pin Count | 3 | |
| Manufacturer Package Code | SOT23 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | NXP |
BFS17A,235 Frequently Asked Questions (FAQ)
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A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
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Use a thermally conductive material for the heat sink, ensure good airflow, and consider using a thermal interface material to improve heat transfer. Also, follow the recommended operating conditions and derating guidelines.
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Use a common mode choke, a differential mode inductor, and a capacitor with a high self-resonant frequency to filter out EMI. Ensure the filter components are placed close to the BFS17A,235 and the PCB layout is optimized for EMI reduction.
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Choose capacitors with low equivalent series resistance (ESR) and high ripple current capability. Ensure the capacitors are placed close to the BFS17A,235 and the PCB layout is optimized for low inductance and resistance.
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Use a heat sink with a high thermal conductivity, ensure good thermal contact between the BFS17A,235 and the heat sink, and consider using a thermal interface material. Also, ensure good airflow and follow the recommended operating conditions and derating guidelines.