Part Details for BDX34B by SPC Multicomp
Results Overview of BDX34B by SPC Multicomp
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BDX34B Information
BDX34B by SPC Multicomp is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for BDX34B
BDX34B CAD Models
BDX34B Part Data Attributes
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BDX34B
SPC Multicomp
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Datasheet
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BDX34B
SPC Multicomp
Power Bipolar Transistor, 10A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin, TO-220, 3 PIN
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | MULTICOMP PRO | |
| Package Description | TO-220, 3 PIN | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | Multicomp Pro | |
| Case Connection | COLLECTOR | |
| Collector Current-Max (IC) | 10 A | |
| Collector-Emitter Voltage-Max | 80 V | |
| Configuration | DARLINGTON WITH BUILT-IN RESISTOR | |
| DC Current Gain-Min (hFE) | 750 | |
| JEDEC-95 Code | TO-220AB | |
| JESD-30 Code | R-PSFM-T3 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Operating Temperature-Min | -65 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | FLANGE MOUNT | |
| Polarity/Channel Type | NPN | |
| Surface Mount | NO | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Position | SINGLE | |
| Transistor Element Material | SILICON |
BDX34B Frequently Asked Questions (FAQ)
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The recommended PCB footprint for the BDX34B is a standard TO-220 package with a minimum pad size of 5.5mm x 4.5mm and a thermal pad size of 2.5mm x 2.5mm.
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While the BDX34B is suitable for switching applications, its high-frequency performance is limited due to its relatively high capacitance and inductance. For high-frequency switching, consider using a transistor with lower capacitance and inductance, such as the BDX54B or BDX64B.
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To ensure reliable operation in high-temperature environments, ensure proper heat sinking, keep the junction temperature below 150°C, and avoid exceeding the maximum power dissipation. Also, consider using a thermal interface material to improve heat transfer between the transistor and heat sink.
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The recommended derating curve for the BDX34B is to reduce the maximum power dissipation by 2.5mW/°C above 25°C. This ensures reliable operation and prevents thermal runaway.
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While the BDX34B is primarily designed for switching applications, it can be used in linear amplifier applications with careful consideration of its linearity, gain, and thermal performance. However, a more suitable transistor for linear amplifiers might be the 2N3055 or MJ15024.