Part Details for BCP5610QTA by Diodes Incorporated
Results Overview of BCP5610QTA by Diodes Incorporated
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BCP5610QTA Information
BCP5610QTA by Diodes Incorporated is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BCP5610QTA
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
BCP5610QTADI-ND
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DigiKey | TRANS NPN 80V 1A SOT-223-3 Min Qty: 1000 Lead time: 12 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$0.0831 / $0.1403 | Buy Now |
DISTI #
BCP5610QTA
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Avnet Americas | Transistor GP BJT NPN 80V 1A 4-Pin SOT-223 T/R - Tape and Reel (Alt: BCP5610QTA) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 16 Weeks, 0 Days Container: Reel | 0 |
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$0.0922 / $0.1215 | Buy Now |
DISTI #
621-BCP5610QTA
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Mouser Electronics | Bipolar Transistors - BJT Pwr Mid Perf Transistor SOT223 T&R 1K RoHS: Compliant | 0 |
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$0.0830 / $0.3900 | Order Now |
DISTI #
BCP5610QTA
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TME | Transistor: NPN Min Qty: 1 | 0 |
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$0.0970 / $0.6960 | RFQ |
DISTI #
BCP5610QTA
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Avnet Silica | Transistor GP BJT NPN 80V 1A 4Pin SOT223 TR (Alt: BCP5610QTA) RoHS: Compliant Min Qty: 1000 Package Multiple: 1000 Lead time: 10 Weeks, 0 Days | Silica - 1000 |
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Buy Now |
Part Details for BCP5610QTA
BCP5610QTA CAD Models
BCP5610QTA Part Data Attributes
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BCP5610QTA
Diodes Incorporated
Buy Now
Datasheet
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BCP5610QTA
Diodes Incorporated
Power Bipolar Transistor,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | DIODES INC | |
Package Description | SOT-223, 4 PIN | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
Factory Lead Time | 16 Weeks | |
Samacsys Manufacturer | Diodes Incorporated | |
Additional Feature | HIGH RELIABILITY | |
Case Connection | COLLECTOR | |
Collector Current-Max (IC) | 1 A | |
Collector-Base Capacitance-Max | 25 pF | |
Collector-Emitter Voltage-Max | 80 V | |
Configuration | SINGLE | |
DC Current Gain-Min (hFE) | 25 | |
JESD-30 Code | R-PDSO-G4 | |
JESD-609 Code | e3 | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 4 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Polarity/Channel Type | NPN | |
Power Dissipation-Max (Abs) | 2 W | |
Reference Standard | AEC-Q101 | |
Surface Mount | YES | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Transistor Application | SWITCHING | |
Transistor Element Material | SILICON | |
Transition Frequency-Nom (fT) | 150 MHz | |
VCEsat-Max | 0.5 V |
BCP5610QTA Frequently Asked Questions (FAQ)
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A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the IC to dissipate heat effectively.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and provide adequate heat sinking and airflow around the device.
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The BCP5610QTA has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices if the device will be exposed to high-risk ESD environments.
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While the BCP5610QTA is a high-quality device, it's essential to check the device's AEC-Q100 qualification and PPAP (Production Part Approval Process) documentation to ensure it meets the specific requirements of your high-reliability or automotive application.
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Follow the recommended soldering and assembly techniques outlined in the Diodes Incorporated application note AN-111, which provides guidance on reflow soldering, wave soldering, and manual assembly.