Part Details for BCP56-16 by NXP Semiconductors
Results Overview of BCP56-16 by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Energy and Power Systems
Renewable Energy
BCP56-16 Information
BCP56-16 by NXP Semiconductors is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BCP56-16
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 7036 |
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RFQ | ||
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Bristol Electronics | Min Qty: 20 | 580 |
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$0.0788 / $0.2625 | Buy Now |
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DISTI #
SMC-BCP56-16
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Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 253872 |
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RFQ |
Part Details for BCP56-16
BCP56-16 CAD Models
BCP56-16 Part Data Attributes
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BCP56-16
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
BCP56-16
NXP Semiconductors
TRANSISTOR Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-73, 4 PIN, BIP General Purpose Small Signal
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SC-73 | |
| Package Description | PLASTIC, SC-73, 4 PIN | |
| Pin Count | 4 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.75 | |
| Samacsys Manufacturer | NXP | |
| Case Connection | COLLECTOR | |
| Collector Current-Max (IC) | 1 A | |
| Collector-Emitter Voltage-Max | 80 V | |
| Configuration | SINGLE | |
| DC Current Gain-Min (hFE) | 100 | |
| JESD-30 Code | R-PDSO-G4 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | NPN | |
| Power Dissipation Ambient-Max | 1.5 W | |
| Power Dissipation-Max (Abs) | 1.5 W | |
| Qualification Status | Not Qualified | |
| Reference Standard | IEC 60134 | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON | |
| Transition Frequency-Nom (fT) | 180 MHz |
Alternate Parts for BCP56-16
This table gives cross-reference parts and alternative options found for BCP56-16. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BCP56-16, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| BCP56-16E6433 | Infineon Technologies AG | Check for Price | Small Signal Bipolar Transistor, 1A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon | BCP56-16 vs BCP56-16E6433 |
| BCP56E6433 | Infineon Technologies AG | Check for Price | Small Signal Bipolar Transistor, 1A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, | BCP56-16 vs BCP56E6433 |
| BCP56_NL | Fairchild Semiconductor Corporation | Check for Price | Small Signal Bipolar Transistor, 1.2A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon, TO-261AA, SOT-223, 3 PIN | BCP56-16 vs BCP56_NL |
| BCP56 | Texas Instruments | Check for Price | 1500mA, 80V, NPN, Si, SMALL SIGNAL TRANSISTOR | BCP56-16 vs BCP56 |
| BCP56-10E6327 | Siemens | Check for Price | Small Signal Bipolar Transistor, 1A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon | BCP56-16 vs BCP56-10E6327 |
| BCP56 | National Semiconductor Corporation | Check for Price | Small Signal Bipolar Transistor, 1.5A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon | BCP56-16 vs BCP56 |
| BCP56-10 | NXP Semiconductors | Check for Price | TRANSISTOR Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-73, 4 PIN, BIP General Purpose Small Signal | BCP56-16 vs BCP56-10 |
| BCP56D84Z | Texas Instruments | Check for Price | Si, SMALL SIGNAL TRANSISTOR, TO-261 | BCP56-16 vs BCP56D84Z |
| BCP56-10E6433 | Infineon Technologies AG | Check for Price | Small Signal Bipolar Transistor, 1A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon | BCP56-16 vs BCP56-10E6433 |
| BCP56E6327 | Infineon Technologies AG | Check for Price | Small Signal Bipolar Transistor, 1A I(C), 80V V(BR)CEO, 1-Element, NPN, Silicon | BCP56-16 vs BCP56E6327 |
BCP56-16 Frequently Asked Questions (FAQ)
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NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider derating the device's power dissipation and voltage ratings according to the datasheet's thermal derating curves.
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NXP recommends soldering the BCP56-16 using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. The recommended soldering profile is available in the NXP application note AN10365.
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To troubleshoot OTP issues, check the thermal design and ensure that the device is properly heat-sunk. Verify that the thermal pad is connected to a large copper area on the PCB and that the thermal interface material is properly applied. Also, check the device's power dissipation and voltage ratings to ensure they are within the recommended limits.
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To prevent electrostatic discharge (ESD) damage, NXP recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins of the BCP56-16. Additionally, follow proper handling and storage procedures, and use an ESD-protected workstation and tools during assembly and testing.