Part Details for BCP55-16 by STMicroelectronics
Results Overview of BCP55-16 by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (3 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BCP55-16 Information
BCP55-16 by STMicroelectronics is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Part Details for BCP55-16
BCP55-16 CAD Models
BCP55-16 Part Data Attributes
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BCP55-16
STMicroelectronics
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Datasheet
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BCP55-16
STMicroelectronics
1A, 60V, NPN, Si, POWER TRANSISTOR, PLASTIC PACKAGE-4
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Package Description | PLASTIC PACKAGE-4 | |
| Pin Count | 4 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Case Connection | COLLECTOR | |
| Collector Current-Max (IC) | 1 A | |
| Collector-Emitter Voltage-Max | 60 V | |
| Configuration | SINGLE | |
| DC Current Gain-Min (hFE) | 25 | |
| JESD-30 Code | R-PDSO-G4 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Polarity/Channel Type | NPN | |
| Power Dissipation-Max (Abs) | 1.4 W | |
| Qualification Status | Not Qualified | |
| Surface Mount | YES | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON | |
| Transition Frequency-Nom (fT) | 120 MHz |
Alternate Parts for BCP55-16
This table gives cross-reference parts and alternative options found for BCP55-16. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BCP55-16, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| BCP55-16T/R | NXP Semiconductors | Check for Price | TRANSISTOR 1 A, 60 V, NPN, Si, POWER TRANSISTOR, BIP General Purpose Power | BCP55-16 vs BCP55-16T/R |
| BCP55-16TC | Zetex / Diodes Inc | Check for Price | Power Bipolar Transistor, 1A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, Plastic/Epoxy, 4 Pin | BCP55-16 vs BCP55-16TC |
| BCP55-16TA | Diodes Incorporated | Check for Price | 1A, 60V, NPN, Si, POWER TRANSISTOR | BCP55-16 vs BCP55-16TA |
BCP55-16 Frequently Asked Questions (FAQ)
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STMicroelectronics recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the BCP55-16. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Ensure proper airflow and avoid overheating the device.
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Handle the BCP55-16 with care to prevent mechanical damage. Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Follow standard ESD handling procedures to prevent damage from electrostatic discharge.
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To troubleshoot issues with the BCP55-16, start by verifying the device's pinout and connections. Check the input and output voltages, and ensure that the device is operating within its recommended specifications. Use oscilloscopes or logic analyzers to debug the circuit, and consult STMicroelectronics' application notes and technical support resources for guidance.
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Yes, follow STMicroelectronics' recommended soldering and rework procedures to avoid damaging the BCP55-16. Use a soldering iron with a temperature range of 250°C to 260°C, and ensure that the soldering time is limited to 3-5 seconds per pin. Avoid using excessive force or pressure during rework, and follow standard IPC guidelines for soldering and rework.