Part Details for BCP55-16 by NXP Semiconductors
Results Overview of BCP55-16 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (1 replacement)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (9 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BCP55-16 Information
BCP55-16 by NXP Semiconductors is a Power Bipolar Transistor.
Power Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BCP55-16
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 708 |
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RFQ | ||
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Quest Components | 1 A, 60 V, NPN, SI, POWER TRANSISTOR | 566 |
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$0.1620 / $0.5400 | Buy Now |
Part Details for BCP55-16
BCP55-16 CAD Models
BCP55-16 Part Data Attributes
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BCP55-16
NXP Semiconductors
Buy Now
Datasheet
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BCP55-16
NXP Semiconductors
TRANSISTOR Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-73, 4 PIN, BIP General Purpose Small Signal
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Part Package Code | SC-73 | |
| Package Description | PLASTIC, SC-73, 4 PIN | |
| Pin Count | 4 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8541.29.00.75 | |
| Samacsys Manufacturer | NXP | |
| Case Connection | COLLECTOR | |
| Collector Current-Max (IC) | 1 A | |
| Collector-Emitter Voltage-Max | 60 V | |
| Configuration | SINGLE | |
| DC Current Gain-Min (hFE) | 100 | |
| JESD-30 Code | R-PDSO-G4 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 4 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | NPN | |
| Power Dissipation Ambient-Max | 1.5 W | |
| Power Dissipation-Max (Abs) | 1.5 W | |
| Qualification Status | Not Qualified | |
| Reference Standard | IEC 60134 | |
| Surface Mount | YES | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON | |
| Transition Frequency-Nom (fT) | 130 MHz |
Alternate Parts for BCP55-16
This table gives cross-reference parts and alternative options found for BCP55-16. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of BCP55-16, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| BCP55-16E6433 | Siemens | Check for Price | Power Bipolar Transistor, 1-Element, Silicon, Plastic/Epoxy, 4 Pin | BCP55-16 vs BCP55-16E6433 |
BCP55-16 Frequently Asked Questions (FAQ)
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NXP recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
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To ensure reliable operation at high temperatures, it's essential to follow NXP's recommended thermal design guidelines, including proper heat sinking, thermal interface materials, and PCB layout. Additionally, consider derating the device's power dissipation and voltage ratings according to the datasheet's thermal derating curves.
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The BCP55-16 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices, such as TVS diodes, to protect the device from external ESD events.
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Yes, the BCP55-16 is qualified for automotive and high-reliability applications. However, it's essential to follow NXP's recommended design guidelines, testing procedures, and qualification requirements to ensure the device meets the specific application's reliability and quality standards.
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To troubleshoot common issues, start by reviewing the datasheet and application notes for proper design and layout guidelines. Check for proper thermal management, voltage and current ratings, and ensure that the device is operated within its recommended specifications. Use oscilloscopes and other diagnostic tools to identify and isolate the issue.