Part Details for BC857CE6327 by Infineon Technologies AG
Results Overview of BC857CE6327 by Infineon Technologies AG
- Distributor Offerings: (10 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Security and Surveillance
Audio and Video Systems
BC857CE6327 Information
BC857CE6327 by Infineon Technologies AG is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BC857CE6327
| Part # | Distributor | Description | Stock | Price | Buy | |
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Bristol Electronics | 4439 |
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Bristol Electronics | 2951 |
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Bristol Electronics | 1100 |
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Quest Components | 100 MA, 45 V, PNP, SI, SMALL SIGNAL TRANSISTOR | 3551 |
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$0.0744 / $0.2480 | Buy Now |
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Quest Components | 100 MA, 45 V, PNP, SI, SMALL SIGNAL TRANSISTOR | 2175 |
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$0.0446 / $0.0992 | Buy Now |
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Quest Components | 100 MA, 45 V, PNP, SI, SMALL SIGNAL TRANSISTOR | 1960 |
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$0.0744 / $0.2480 | Buy Now |
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Quest Components | 100 MA, 45 V, PNP, SI, SMALL SIGNAL TRANSISTOR | 880 |
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$0.0630 / $0.2100 | Buy Now |
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DISTI #
BC857CE6327
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TME | Transistor: PNP, bipolar, 45V, 0.1A, 0.33W, SOT23 Min Qty: 20 | 795 |
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$0.0359 / $0.0742 | Buy Now |
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ComSIT USA | PNP SILICON AF TRANSISTOR Small Signal Bipolar Transistor, 0.1A I(C), 45V V(BR)CEO, 1-Element, PNP, Silicon ECCN: EAR99 RoHS: Compliant |
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Chip 1 Exchange | INSTOCK | 120 |
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Part Details for BC857CE6327
BC857CE6327 CAD Models
BC857CE6327 Part Data Attributes
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BC857CE6327
Infineon Technologies AG
Buy Now
Datasheet
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BC857CE6327
Infineon Technologies AG
Small Signal Bipolar Transistor, 0.1A I(C), 45V V(BR)CEO, 1-Element, PNP, Silicon,
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | End Of Life | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| Factory Lead Time | 4 Weeks | |
| Collector Current-Max (IC) | 0.1 A | |
| Collector-Emitter Voltage-Max | 45 V | |
| Configuration | SINGLE | |
| DC Current Gain-Min (hFE) | 420 | |
| JESD-30 Code | R-PDSO-G3 | |
| JESD-609 Code | e3 | |
| Moisture Sensitivity Level | 1 | |
| Number of Elements | 1 | |
| Number of Terminals | 3 | |
| Operating Temperature-Max | 150 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Polarity/Channel Type | PNP | |
| Power Dissipation-Max (Abs) | 0.33 W | |
| Qualification Status | Not Qualified | |
| Reference Standard | AEC-Q101 | |
| Surface Mount | YES | |
| Terminal Finish | TIN | |
| Terminal Form | GULL WING | |
| Terminal Position | DUAL | |
| Transistor Application | SWITCHING | |
| Transistor Element Material | SILICON | |
| Transition Frequency-Nom (fT) | 250 MHz |
BC857CE6327 Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout for the BC857CE6327 in their application note AN2013-01. It suggests using a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
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To ensure reliable operation in high-temperature environments, it's essential to follow Infineon's guidelines for thermal management. This includes using a heat sink, ensuring good airflow, and avoiding thermal hotspots. Additionally, consider using a thermistor or temperature sensor to monitor the device's temperature and take corrective action if necessary.
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Operating the BC857CE6327 at the maximum junction temperature (Tj) of 150°C can reduce its lifespan and reliability. It's recommended to keep the junction temperature below 125°C to ensure optimal performance and longevity. Exceeding the maximum Tj can lead to thermal runaway, reduced performance, and even device failure.
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To prevent electrostatic discharge (ESD) damage, handle the BC857CE6327 with care, using ESD-protective equipment and following proper handling procedures. Ensure that the device is stored in an ESD-protected environment, and use ESD-protective packaging during transportation and storage.
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Infineon recommends following the JEDEC standard J-STD-020D for soldering the BC857CE6327. This includes using a peak temperature of 260°C, a soldering time of 10-30 seconds, and a temperature profile that avoids thermal shocks.