Datasheets
BC817K40E6327XT by: Infineon Technologies AG

Small Signal Bipolar Transistor, 0.5A I(C), 45V V(BR)CEO, 1-Element, NPN, Silicon, ROHS COMPLIANT PACKAGE-3

Part Details for BC817K40E6327XT by Infineon Technologies AG

Results Overview of BC817K40E6327XT by Infineon Technologies AG

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BC817K40E6327XT Information

BC817K40E6327XT by Infineon Technologies AG is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for BC817K40E6327XT

Part # Distributor Description Stock Price Buy
Quest Components   2136
  • 1 $2.4500
  • 273 $0.6370
  • 1,257 $0.6125
$0.6125 / $2.4500 Buy Now
Vyrian Transistors 8599
RFQ

Part Details for BC817K40E6327XT

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BC817K40E6327XT Part Data Attributes

BC817K40E6327XT Infineon Technologies AG
Buy Now Datasheet
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BC817K40E6327XT Infineon Technologies AG Small Signal Bipolar Transistor, 0.5A I(C), 45V V(BR)CEO, 1-Element, NPN, Silicon, ROHS COMPLIANT PACKAGE-3
Part Life Cycle Code End Of Life
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description ROHS COMPLIANT PACKAGE-3
Reach Compliance Code unknown
ECCN Code EAR99
Factory Lead Time 4 Weeks
Samacsys Manufacturer Infineon
Collector Current-Max (IC) 0.5 A
Collector-Emitter Voltage-Max 45 V
Configuration SINGLE
DC Current Gain-Min (hFE) 250
JESD-30 Code R-PDSO-G3
Number of Elements 1
Number of Terminals 3
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Polarity/Channel Type NPN
Reference Standard AEC-Q101
Surface Mount YES
Terminal Form GULL WING
Terminal Position DUAL
Transistor Application AMPLIFIER
Transistor Element Material SILICON
Transition Frequency-Nom (fT) 170 MHz

BC817K40E6327XT Frequently Asked Questions (FAQ)

  • Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance.

  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable thermal interface material, and consider using a heat sink or cooling system. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal stress.

  • Operating the device beyond the recommended maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.

  • To prevent electrostatic discharge (ESD) damage, follow proper handling and assembly procedures, such as using ESD-protective packaging, wrist straps, and mats. Ensure that the device is properly grounded during assembly, and avoid touching the device's pins or exposed internal components.

  • Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the devices by the body, avoiding touching the pins or exposed internal components. Follow the recommended storage temperature range of -40°C to 125°C.

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