Part Details for BC817K40E6327XT by Infineon Technologies AG
Results Overview of BC817K40E6327XT by Infineon Technologies AG
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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BC817K40E6327XT Information
BC817K40E6327XT by Infineon Technologies AG is a Small Signal Bipolar Transistor.
Small Signal Bipolar Transistors are under the broader part category of Transistors.
A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.
Price & Stock for BC817K40E6327XT
Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | 2136 |
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$0.6125 / $2.4500 | Buy Now | |
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Vyrian | Transistors | 8599 |
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RFQ |
Part Details for BC817K40E6327XT
BC817K40E6327XT CAD Models
BC817K40E6327XT Part Data Attributes
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BC817K40E6327XT
Infineon Technologies AG
Buy Now
Datasheet
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Compare Parts:
BC817K40E6327XT
Infineon Technologies AG
Small Signal Bipolar Transistor, 0.5A I(C), 45V V(BR)CEO, 1-Element, NPN, Silicon, ROHS COMPLIANT PACKAGE-3
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Part Life Cycle Code | End Of Life | |
Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
Package Description | ROHS COMPLIANT PACKAGE-3 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
Factory Lead Time | 4 Weeks | |
Samacsys Manufacturer | Infineon | |
Collector Current-Max (IC) | 0.5 A | |
Collector-Emitter Voltage-Max | 45 V | |
Configuration | SINGLE | |
DC Current Gain-Min (hFE) | 250 | |
JESD-30 Code | R-PDSO-G3 | |
Number of Elements | 1 | |
Number of Terminals | 3 | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Polarity/Channel Type | NPN | |
Reference Standard | AEC-Q101 | |
Surface Mount | YES | |
Terminal Form | GULL WING | |
Terminal Position | DUAL | |
Transistor Application | AMPLIFIER | |
Transistor Element Material | SILICON | |
Transition Frequency-Nom (fT) | 170 MHz |
BC817K40E6327XT Frequently Asked Questions (FAQ)
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Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to minimize thermal resistance.
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To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable thermal interface material, and consider using a heat sink or cooling system. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal stress.
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Operating the device beyond the recommended maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially catastrophic failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
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To prevent electrostatic discharge (ESD) damage, follow proper handling and assembly procedures, such as using ESD-protective packaging, wrist straps, and mats. Ensure that the device is properly grounded during assembly, and avoid touching the device's pins or exposed internal components.
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Store the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the devices by the body, avoiding touching the pins or exposed internal components. Follow the recommended storage temperature range of -40°C to 125°C.