-
Part Symbol
-
Footprint
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
BAP70-02 - Silicon PIN diode SOD 2-Pin
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
BAP70-02,115 by NXP Semiconductors is a PIN Diode.
PIN Diodes are under the broader part category of Diodes.
A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
70R1930
|
Newark | Silicon Pin Diode, Full Reel, Diode Configuration:Single, Resistance @ If:1.4Ohm, Reverse Voltage:50V, Diode Case Style:Sod-523, No. Of Pins:2 Pin, Diode Capacitance:0.25Pf, Forward Current:100Ma, Operating Temperature Max:150°C Rohs Compliant: Yes |Nxp BAP70-02,115 RoHS: Compliant Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
$0.0950 / $0.1650 | Buy Now |
DISTI #
568-1940-1-ND
|
DigiKey | RF DIODE PIN 50V 415MW SOD-523 Min Qty: 1 Lead time: 13 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
19683 In Stock |
|
$0.0968 / $0.2600 | Buy Now |
DISTI #
568-1940-6-ND
|
DigiKey | RF DIODE PIN 50V 415MW SOD-523 Min Qty: 1 Lead time: 13 Weeks Container: Digi-Reel® | Temporarily Out of Stock |
|
Buy Now | |
DISTI #
BAP70-02,115
|
Avnet Americas | Diode PIN Attenuator 50V 2-Pin SOD-523 T/R - Tape and Reel (Alt: BAP70-02,115) RoHS: Compliant Min Qty: 9000 Package Multiple: 3000 Lead time: 13 Weeks, 0 Days Container: Reel | 0 |
|
$0.0834 / $0.0981 | Buy Now |
DISTI #
771-BAP70-02-T/R
|
Mouser Electronics | PIN Diodes PIN 50V 100MA RoHS: Compliant | 18220 |
|
$0.0950 / $0.2600 | Buy Now |
DISTI #
E02:0323_00016399
|
Arrow Electronics | Diode PIN Attenuator 50V 100mA 2-Pin SOD-523 T/R Automotive AEC-Q101 RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 13 Weeks Date Code: 2401 | Europe - 3000 |
|
$0.0939 / $0.1026 | Buy Now |
DISTI #
87768186
|
Verical | Diode PIN Attenuator 50V 100mA 2-Pin SOD-523 T/R Automotive AEC-Q101 RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Date Code: 2401 | Americas - 3000 |
|
$0.1658 | Buy Now |
|
Rochester Electronics | DIODE PIN 50V 100MA SOD-523 RoHS: Compliant Status: Active Min Qty: 1 | 493 |
|
$0.0771 / $0.1243 | Buy Now |
DISTI #
BAP70-02.115
|
TME | Diode: switching, 50V, 100mA, 415mW, SOD523, single diode Min Qty: 1 | 6920 |
|
$0.0960 / $0.5010 | Buy Now |
DISTI #
BAP70-02-115
|
Richardson RFPD | RF SMALL SIGNAL TRANSISTOR BIPOLAR/HBT RoHS: Compliant Min Qty: 9000 | 0 |
|
$0.1100 | Buy Now |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
|
BAP70-02,115
NXP Semiconductors
Buy Now
Datasheet
|
Compare Parts:
BAP70-02,115
NXP Semiconductors
BAP70-02 - Silicon PIN diode SOD 2-Pin
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Part Package Code | SOD | |
Package Description | ULTRA SMALL, PLASTIC, SC-79, 2 PIN | |
Pin Count | 2 | |
Manufacturer Package Code | SOD523 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8541.10.00 | |
Factory Lead Time | 13 Weeks | |
Samacsys Manufacturer | NXP | |
Additional Feature | HIGH VOLTAGE | |
Application | ATTENUATOR | |
Breakdown Voltage-Min | 50 V | |
Configuration | SINGLE | |
Diode Capacitance-Max | 0.25 pF | |
Diode Capacitance-Nom | 0.57 pF | |
Diode Element Material | SILICON | |
Diode Forward Resistance-Max | 1.9 Ω | |
Diode Res Test Current | 0.5 mA | |
Diode Res Test Frequency | 100 MHz | |
Diode Type | PIN DIODE | |
JESD-30 Code | R-PDSO-F2 | |
JESD-609 Code | e3 | |
Minority Carrier Lifetime-Nom | 1.25 µs | |
Moisture Sensitivity Level | 1 | |
Number of Elements | 1 | |
Number of Terminals | 2 | |
Operating Temperature-Max | 150 °C | |
Operating Temperature-Min | -65 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE | |
Peak Reflow Temperature (Cel) | 260 | |
Power Dissipation-Max | 0.415 W | |
Qualification Status | Not Qualified | |
Reverse Test Voltage | ||
Surface Mount | YES | |
Technology | POSITIVE-INTRINSIC-NEGATIVE | |
Terminal Finish | Tin (Sn) | |
Terminal Form | FLAT | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 |
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a thermal interface material between the device and the heat sink.
The recommended soldering conditions for BAP70-02,115 are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that prevents thermal shock.
To handle ESD protection, use an ESD-protected workstation, wear an ESD strap, and use ESD-protected packaging and handling procedures to prevent damage to the device.
Using a different package type may affect the device's thermal performance, power handling, and PCB layout requirements. Consult the datasheet and application notes for specific guidance on package type variations.