Datasheets
BAP70-02,115 by: NXP Semiconductors

BAP70-02 - Silicon PIN diode SOD 2-Pin

Part Details for BAP70-02,115 by NXP Semiconductors

Results Overview of BAP70-02,115 by NXP Semiconductors

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Applications Space Technology Aerospace and Defense

BAP70-02,115 Information

BAP70-02,115 by NXP Semiconductors is a PIN Diode.
PIN Diodes are under the broader part category of Diodes.

A diode is a electrical part that can control the direction in which the current flows in a device. Consider factors like voltage drop, current capacity, reverse voltage, and operating frequency when selecting a diode. Read more about Diodes on our Diodes part category page.

Price & Stock for BAP70-02,115

Part # Distributor Description Stock Price Buy
DISTI # 70R1930
Newark Silicon Pin Diode, Full Reel, Diode Configuration:Single, Resistance @ If:1.4Ohm, Reverse Voltage:50V, Diode Case Style:Sod-523, No. Of Pins:2 Pin, Diode Capacitance:0.25Pf, Forward Current:100Ma, Operating Temperature Max:150°C Rohs Compliant: Yes |Nxp BAP70-02,115 RoHS: Compliant Min Qty: 3000 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 3,000 $0.1650
  • 6,000 $0.1350
  • 12,000 $0.1170
  • 18,000 $0.1090
  • 30,000 $0.0950
$0.0950 / $0.1650 Buy Now
DISTI # 568-1940-1-ND
DigiKey RF DIODE PIN 50V 415MW SOD-523 Min Qty: 1 Lead time: 13 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) 19683
In Stock
  • 1 $0.2600
  • 10 $0.1810
  • 25 $0.1604
  • 100 $0.1374
  • 250 $0.1265
  • 500 $0.1199
  • 1,000 $0.1145
  • 3,000 $0.1078
  • 6,000 $0.1045
  • 9,000 $0.1029
  • 15,000 $0.1011
  • 21,000 $0.1000
  • 30,000 $0.0990
  • 75,000 $0.0968
$0.0968 / $0.2600 Buy Now
DISTI # 568-1940-6-ND
DigiKey RF DIODE PIN 50V 415MW SOD-523 Min Qty: 1 Lead time: 13 Weeks Container: Digi-Reel® Temporarily Out of Stock
Buy Now
DISTI # BAP70-02,115
Avnet Americas Diode PIN Attenuator 50V 2-Pin SOD-523 T/R - Tape and Reel (Alt: BAP70-02,115) RoHS: Compliant Min Qty: 9000 Package Multiple: 3000 Lead time: 13 Weeks, 0 Days Container: Reel 0
  • 9,000 $0.0981
  • 15,000 $0.0944
  • 24,000 $0.0908
  • 45,000 $0.0871
  • 90,000 $0.0834
$0.0834 / $0.0981 Buy Now
DISTI # 771-BAP70-02-T/R
Mouser Electronics PIN Diodes PIN 50V 100MA RoHS: Compliant 18220
  • 1 $0.2600
  • 10 $0.1610
  • 100 $0.1270
  • 500 $0.1200
  • 1,000 $0.1150
  • 3,000 $0.1070
  • 6,000 $0.1040
  • 9,000 $0.1000
  • 24,000 $0.0950
$0.0950 / $0.2600 Buy Now
DISTI # E02:0323_00016399
Arrow Electronics Diode PIN Attenuator 50V 100mA 2-Pin SOD-523 T/R Automotive AEC-Q101 RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 13 Weeks Date Code: 2401 Europe - 3000
  • 3,000 $0.1026
  • 6,000 $0.1003
  • 9,000 $0.0981
  • 15,000 $0.0953
  • 21,000 $0.0946
  • 30,000 $0.0939
$0.0939 / $0.1026 Buy Now
DISTI # 87768186
Verical Diode PIN Attenuator 50V 100mA 2-Pin SOD-523 T/R Automotive AEC-Q101 RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Date Code: 2401 Americas - 3000
  • 3,000 $0.1658
$0.1658 Buy Now
Rochester Electronics DIODE PIN 50V 100MA SOD-523 RoHS: Compliant Status: Active Min Qty: 1 493
  • 100 $0.1243
  • 500 $0.1119
  • 1,000 $0.1032
  • 10,000 $0.0920
  • 100,000 $0.0771
$0.0771 / $0.1243 Buy Now
DISTI # BAP70-02.115
TME Diode: switching, 50V, 100mA, 415mW, SOD523, single diode Min Qty: 1 6920
  • 1 $0.5010
  • 5 $0.3970
  • 10 $0.2680
  • 100 $0.1750
  • 500 $0.1360
  • 1,000 $0.0970
  • 21,000 $0.0960
$0.0960 / $0.5010 Buy Now
DISTI # BAP70-02-115
Richardson RFPD RF SMALL SIGNAL TRANSISTOR BIPOLAR/HBT RoHS: Compliant Min Qty: 9000 0
  • 9,000 $0.1100
$0.1100 Buy Now
DISTI # BAP70-02,115
Avnet Silica Diode PIN Attenuator 50V 2Pin SOD523 TR (Alt: BAP70-02,115) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 15 Weeks, 0 Days Silica - 0
Buy Now
DISTI # BAP70-02,115
EBV Elektronik Diode PIN Attenuator 50V 2Pin SOD523 TR (Alt: BAP70-02,115) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 15 Weeks, 0 Days EBV - 3000
Buy Now

Part Details for BAP70-02,115

BAP70-02,115 CAD Models

BAP70-02,115 Part Data Attributes

BAP70-02,115 NXP Semiconductors
Buy Now Datasheet
Compare Parts:
BAP70-02,115 NXP Semiconductors BAP70-02 - Silicon PIN diode SOD 2-Pin
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Part Package Code SOD
Package Description ULTRA SMALL, PLASTIC, SC-79, 2 PIN
Pin Count 2
Manufacturer Package Code SOD523
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8541.10.00
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Additional Feature HIGH VOLTAGE
Application ATTENUATOR
Breakdown Voltage-Min 50 V
Configuration SINGLE
Diode Capacitance-Max 0.25 pF
Diode Capacitance-Nom 0.57 pF
Diode Element Material SILICON
Diode Forward Resistance-Max 1.9 Ω
Diode Res Test Current 0.5 mA
Diode Res Test Frequency 100 MHz
Diode Type PIN DIODE
JESD-30 Code R-PDSO-F2
JESD-609 Code e3
Minority Carrier Lifetime-Nom 1.25 µs
Moisture Sensitivity Level 1
Number of Elements 1
Number of Terminals 2
Operating Temperature-Max 150 °C
Operating Temperature-Min -65 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Power Dissipation-Max 0.415 W
Qualification Status Not Qualified
Reverse Test Voltage
Surface Mount YES
Technology POSITIVE-INTRINSIC-NEGATIVE
Terminal Finish Tin (Sn)
Terminal Form FLAT
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) 30

BAP70-02,115 Related Parts

BAP70-02,115 Frequently Asked Questions (FAQ)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.

  • To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a thermal interface material between the device and the heat sink.

  • The recommended soldering conditions for BAP70-02,115 are a peak temperature of 260°C, a soldering time of 10-30 seconds, and a soldering method that prevents thermal shock.

  • To handle ESD protection, use an ESD-protected workstation, wear an ESD strap, and use ESD-protected packaging and handling procedures to prevent damage to the device.

  • Using a different package type may affect the device's thermal performance, power handling, and PCB layout requirements. Consult the datasheet and application notes for specific guidance on package type variations.

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