Datasheets
AUIRFS3806 by:

Power Field-Effect Transistor, 43A I(D), 60V, 0.0158ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3

Part Details for AUIRFS3806 by Infineon Technologies AG

Results Overview of AUIRFS3806 by Infineon Technologies AG

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AUIRFS3806 Information

AUIRFS3806 by Infineon Technologies AG is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for AUIRFS3806

Part # Distributor Description Stock Price Buy
DISTI # 85965889
Verical Trans MOSFET N-CH Si 60V 43A Automotive AEC-Q101 3-Pin(2+Tab) D2PAK Tube Min Qty: 273 Package Multiple: 1 Date Code: 1601 Americas - 676
  • 273 $1.3750
  • 500 $1.2323
  • 1,000 $1.1364
  • 10,000 $1.0131
  • 100,000 $0.8489
$0.8489 / $1.3750 Buy Now
Rochester Electronics AUIRFS3806 - 55V-60V N-Channel Automotive MOSFET RoHS: Compliant Status: End of Life / Last Time Buy Min Qty: 1 676
  • 100 $1.1000
  • 500 $0.9858
  • 1,000 $0.9091
  • 10,000 $0.8105
  • 100,000 $0.6791
$0.6791 / $1.1000 Buy Now
DISTI # SP001518108
EBV Elektronik Trans MOSFET NCH 60V 43A 3Pin2Tab D2PAK Tube (Alt: SP001518108) RoHS: Compliant Min Qty: 50 Package Multiple: 50 Lead time: 143 Weeks, 0 Days EBV - 0
Buy Now

Part Details for AUIRFS3806

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AUIRFS3806 Part Data Attributes

AUIRFS3806 Infineon Technologies AG
Buy Now Datasheet
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AUIRFS3806 Infineon Technologies AG Power Field-Effect Transistor, 43A I(D), 60V, 0.0158ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, D2PAK-3
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Package Description D2PAK-3
Reach Compliance Code unknown
ECCN Code EAR99
Factory Lead Time 4 Weeks
Samacsys Manufacturer Infineon
Additional Feature AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE
Avalanche Energy Rating (Eas) 73 mJ
Case Connection DRAIN
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 60 V
Drain Current-Max (ID) 43 A
Drain-source On Resistance-Max 0.0158 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-263AB
JESD-30 Code R-PSSO-G2
JESD-609 Code e3
Number of Elements 1
Number of Terminals 2
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 175 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Polarity/Channel Type N-CHANNEL
Power Dissipation-Max (Abs) 71 W
Pulsed Drain Current-Max (IDM) 170 A
Surface Mount YES
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Form GULL WING
Terminal Position SINGLE
Time@Peak Reflow Temperature-Max (s) 30
Transistor Application SWITCHING
Transistor Element Material SILICON

AUIRFS3806 Related Parts

AUIRFS3806 Frequently Asked Questions (FAQ)

  • Infineon provides a recommended PCB layout in their application note AN2013-03, which includes guidelines for thermal vias, copper thickness, and component placement to ensure optimal thermal performance.

  • Infineon recommends using a gate driver with a minimum output current of 2A and a voltage rating that matches the VGS of the AUIRFS3806. Additionally, consider the driver's rise and fall times, propagation delay, and input voltage range to ensure compatibility.

  • According to Infineon's application note AN2013-03, the maximum allowed voltage overshoot on VDS during switching is 10% of the maximum rated VDS, which is 600V for the AUIRFS3806.

  • To ensure reliable operation in high-temperature environments, follow Infineon's guidelines for thermal management, including using a heat sink, thermal interface material, and ensuring good airflow. Also, consider derating the device's power rating according to the temperature derating curve in the datasheet.

  • Infineon recommends following standard ESD protection measures, including using ESD-sensitive handling and storage procedures, implementing ESD protection circuits in the PCB design, and using ESD-protected devices in the surrounding circuitry.

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